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LeEco Announces Three New Phones, Ditches Headphone Jack

by Ville-Petteri Ukonaho | 4月 20, 2016

LeEco today announced Le 2, Le 2 Pro and Le Max 2 smartphones at an event in China. LeEco is one of the rising microvendors that Strategy Analytics is following closely.

According to Strategy Analytics report on microvendors, last year they reached to 3.9 million in volumes and they are searching growth with these new devices.

Rumors about Apple removing headset jack from next iPhones has been around a while, and now LeEco does just that. Devices come without the standard 3.5mm plug but instead they use the USB Type-C for audio.

While the USB audio means that devices will have better audio quality, it also means that the ability to charge phone while listening music is lost. To boost the audio quality, LeEco announced a new technology with the devices called CDLA (Continual Digital Lossless Audio) that they will be using with the digital headsets. However as a fail-safe, they will include an adapter to the sales package to maintain compatibility with standard headsets. 

All of the devices are equipped with fingerprint scanners in the back but one industry first is the implementation of Qualcomm SenseID fingerprint technology with the Le Max 2. Sense ID is a 3D ultrasonic technology that creates a 3D model of one's fingerprints.

Le 2 is the lower mid range device with decent specifications and all metal build.
  • 5.5-inch (1920 x 1080 pixels) Full HD IPS display
  • 2.3GHz MediaTek Helio X20 deca-core processor 
  • 3GB LPDDR3 RAM, 32GB internal storage
  • 16MP rear camera and 8MP front camera with wide-angle lens
  • 3,000mAh battery with fast charging
Le 2 Pro differs from Le 2 with more memory, bigger rear camera and slightly better processor. Differences to Le 2 are:
  • MediaTek Helio X25 deca-core processor 
  • 4GB LPDDR3 RAM
  • 21MP rear camera
Le Max 2 is the most powerful of them all equipped with industry first 6GB configuration of LPDDR4 RAM. With most devices nowadays coming to the market with 3/4GB of RAM it was expected that someone ups the amount. Device has also Qualcomm Snapdragon 820 and 5.7 inch QHD display. Summary of the specs:
  • 5.7-inch (2560 x 1440 pixels) Quad HD
  • 2.15GHz Quad-Core Snapdragon 820
  • 4GB / 6GB DDR4 RAM, 32GB / 64GB (UFS 2.0) internal memory
  • 21MP rear camera with OIS, 8MP front-facing camera
  • 3100mAh battery with Quick Charge 3.0
All the devices comes with Android 6.0 Marshmallow and EUI 5.8. Other common specs include:
  • 4G LTE, WiFi 802.11 ac/a/b/g/n, Bluetooth 4.2, GPS, USB Type C
  • Infrared sensor, CDLA audio as well as Dolby Atmos 
These devices are technically extremely advanced and the pricing in China is very competitive. Device vendors like Xiaomi, Lenovo, Huawei and others need to watch out these microvendors as they have the potential to disrupt the China market and even global bestseller lists with great value to customers.
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