射频及无线元器件



RF Component Industry Review: January - March 2016



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Report Summary:

Global shipments of cellphones declined sequentially, but this did not prevent stronger sales and profits for radio component suppliers overall.  Notable product announcements included a 1 Gbps LTE chipset from Qualcomm, and an improved smartphone processor from MediaTek.  Activity in Bluetooth Smart for wearables and other IoT applications increased, and 5G started to take shape with several new partnerships and operator tests unveiled.
Table of Contents

1.1     Financial Highlights  9

1.2     Product, Market, Technology Highlights  12

1.3     Mergers, Acquisitions, Divestitures  14

1.4     RF Start-up Funding  15

3.1     Financial 16

3.1.1       Marvell Q3 FY ‘16  16

3.1.2       Intel Q4 and FY ’15  16

3.1.3       TSMC Q4 and FY ‘15  16

3.1.4       Cree Q2 FY ‘16  17

3.1.5       Kumu Raises $25 Million  17

3.1.6       Maxim Q2 FY ‘16  17

3.1.7       Cavium Q4 FY ‘15  17

3.1.8       Qualcomm Q1 FY 2016  18

3.1.9       TI Q4 and FY ‘15  18

3.1.10     UMC Q4 and FY ’15  18

3.1.11     Microsemi Q1 FY ‘16  18

3.1.12     Skyworks Q1 FY 2016  19

3.1.13     Fujitsu Q3 FY ‘15  19

3.1.14     Murata Q3 FY ‘16  19

3.1.15     Seiko-Epson Q3 FY ‘16  19

3.1.16     Sony Q3 FY ‘16  19

3.1.17     TDK Q3 FY ‘16  20

3.1.18     IDT Q3 FY ’16  20

3.1.19     MediaTek Q4 and FY ‘15  20

3.1.20     DSP Group Q4 and FY ‘15  20

3.1.21     Infineon Q1 FY ’16  21

3.1.22     CEVA Q4 and FY ‘15  21

3.1.23     NXP Q4 and FY ’15  21

3.1.24     SEI Q3 FY ’15  21

3.1.25     Silicon Labs Q4 and FY ’15  22

3.1.26     Qorvo Q3 FY’16  22

3.1.27     Sequans Q4 and FY ‘15  22

3.1.28     NDK Q3 FY ’16  22

3.1.29     Maxlinear Q4 FY ‘15  23

3.1.30     ON Semi Q4 FY ’15  23

3.1.31     Renesas Q3 FY 2016  23

3.1.32     Akoustis Q3 ‘FY 16  23

3.1.33     ARM Q4 FY ’15  24

3.1.34     Melexis Q4 and FY ‘15  24

3.1.35     Nordic Semi Q4 and FY ’15  24

3.1.36     Taiyo Yuden Q3 FY ‘16  24

3.1.37     Analog Devices Q1 FY ’16  25

3.1.38     Nvidia Q4 and FY ‘16  25

3.1.39     InterDigital Q4 and FY ‘15  25

3.1.40     TowerJazz Q4 and FY ’15  25

3.1.41     Cypress Q4 and FY ’15  26

3.1.42     Atmel Q4 and FY ’15  26

3.1.43     Semtech Q4 and FY 2016  26

3.1.44     Broadcom Ltd Q1 FY ’16  26

3.1.45     ANADIGICS Q3 FY ‘15  27

3.1.46     ublox FY 2015  28

3.2     Contracts  28

3.2.1       Spalding and ShotTracker use Decawave UWB  28

3.2.2       MaxLinear SoCs Used by MTI, Unitron, Sky  29

3.2.3       Qualcomm 802.11ad in New Products  29

3.2.4       First Smartphone with Latest Qualcomm Flagship Chipset 29

3.2.5       Telefonica Using Quantenna in Home Gateway  30

3.2.6       NXP NFMI in BRAGI Wireless Earphones  30

3.2.7       Cypress Bluetooth Module Sews Up Wearables Win with Hexoskin Smart Shirt 30

3.2.8       Celeno in DOCSIS3.1 Ref Designs  30

3.2.9       Quantenna in STMicro Ref Designs for 4K Ultra HD TV  30

3.2.10     Samsung 14 nm FinFET Logic Process  31

3.2.11     Nordic Semi Bluetooth Design Wins  31

3.2.12     Celeno Qualifies for MaxLinear MoCA Solution  31

3.2.13     PowerTap Specifies Nordic Semi 32

3.2.14     Qorvo 802.11ac PAs in Linksys Wi-Fi 32

3.2.15     Intel in Ip.access Small Cell Platform   32

3.2.16     Qualcomm Works with Small Cell Suppliers for LTE-U  33

3.2.17     ITRI Selects CEVA-XC DSP for 4G Small Cells  33

3.2.18     NXP and Qualcomm Offer Smartphone Processors and NFC  33

3.2.19     Qorvo Expands Support for Leading Smartphone Platform   33

3.2.20     Samsung Processor in Flagship Phones  33

3.2.21     Spreadtrum Uses CEVA in New LTE SoCs  34

3.2.22     Infineon in Samsung Smartphones  34

3.2.23     Peraso Ships 60 GHz Radio Chipset for Infrastructure  34

3.2.24     Qorvo Ships Multiband PAs and Transmit Modules  34

3.2.25     Qualcomm Flagship Processor in Latest Samsung Premium Smartphones  35

3.2.26     u-blox Bluetooth LE for IoT  36

3.2.27     AAC in LeTV Smartphone  36

3.2.28     Cavium Shipping Base Station Processor 36

3.2.29     MediaTek Ups and Downs in Cellphones  36

3.2.30     Qorvo Secures Multiple Mobile Wi-Fi Design Wins  37

3.2.31     Nordic Semi Selected for VR Gaming Platform   37

3.2.32     NXP V2X used by HARMAN  37

3.2.33     ARM Working to Qualify on TSMC 7 nm FinFET Process  37

3.2.34     MediaTek Using TSMC Process for Ultra-Low Power IoT  38

3.2.35     Peregrine Semi RF Switches Accepted by Cable Industry  38

3.2.36     Educational Wireless Computer Uses Nordic Semi 38

3.2.37     Nordic Bluetooth in IoT Development Board  38

3.2.38     Spreadtrum Chipsets in Samsung Smartphones  38

3.2.39     Sequans Licenses Silicon IP from Acorn  39

3.2.40     Nordic Semi in Mesh IoT from Delphian Systems  39

3.2.41     Cycle Century Select Celeno Wi-Fi in STBs  39

3.3     Joint Ventures  39

3.3.1       Qualcomm Forms JV with TDK-EPCOS  39

3.3.2       Qualcomm and Guizhou Form JV for Server Chips  40

3.4     Employment 40

3.4.1       STMicro to Exit Set-Top Box Chips  40

3.4.1       NXP to Expand Product Creation Center in Arizona  41

3.4.2       Imagination Tech CEO Resigns  41

3.4.3       Intel Hires Executive VP from Qualcomm   42

3.4.4       Cohere Adds Executives  42

3.4.5       Cuts at Broadcom / Avago Tech  42

3.5     Products  43

3.5.1       NXP Bluetooth LE for Wearables  43

3.5.2       RFaxis PAs for IoT  43

3.5.3       MaxLinear MoCA 2.0  43

3.5.4       NXP Radar Technology Accelerates ADAS Adoption  43

3.5.5       Marvell Wi-Fi Combo Chips for Wearables, IoT Smart Home  44

3.5.6       Marvell NFC Controller 44

3.5.7       Broadcom Low Power Combo Chip for Mobile Platforms  44

3.5.8       Qualcomm Wi-Fi SON  44

3.5.9       Qualcomm Automotive Processor with Integrated LTE  44

3.5.10     Qualcomm Adds Cost-Optimized Modems  45

3.5.11     Qualcomm Bluetooth Smart 4.2  45

3.5.12     GreenPeak Multi-protocol Radio Chip  45

3.5.13     u-blox GPS/GLONASS  45

3.5.14     Skyworks LNAs & RF Switches for the Connected Home  45

3.5.15     Skyworks Complete PA-FEMs  46

3.5.16     MagnaChip RF SoI Process  47

3.5.17     RFaxis Sub-GHz CMOS RF FE ICs  47

3.5.18     Qorvo 802.11ac Modules  47

3.5.19     STMicro 1.925 GHz to 16 GHz Synthesizer 47

3.5.20     Microsemi PIN Diode Switch  47

3.5.21     Blu Wireless Technology WiGig  48

3.5.22     Analog Devices PLL with VCO Synthesizer for BTS  48

3.5.23     Fujitsu GaN for W-Band  48

3.5.24     Qualcomm Snapdragon Wear Platform   48

3.5.25     Qualcomm Smartphone Processors for Mainstream Devices  48

3.5.26     Qualcomm Gigabit Class LTE Modem   49

3.5.27     u-blox Ultra-compact Wi-Fi Module for IoT  50

3.5.28     Sequans LTE Cat. M Chipset 50

3.5.29     Qualcomm Next-Generation Qualcomm RF360 Front-End Components  51

3.5.30     CEVA-X Efficient Processor Architecture for Baseband Applications  51

3.5.31     MACOM High-Performance GaN Power Transistors for Wireless Basestations  52

3.5.32     Ethertronics Active Steering  52

3.5.33     MediaTek Baseband-Apps Processor for LTE Smartphones  52

3.5.34     MediaTek Chips for Wearables  53

3.5.35     Intel LTE Chips  53

3.5.36     Microsemi LP RF Transceiver for IoT  53

3.5.37     Toshiba Bluetooth LE for Scatternets  53

3.5.38     Toshiba Qi Wireless Charging IC  53

3.5.39     Silicon Labs Blue Gecko Wireless SoC  54

3.5.40     ETA Devices Envelope Tracking  54

3.5.41     Skyworks Next Generation Front End for Global LTE  55

3.5.42     TI Wideband PLL Synths  55

3.5.43     Ampleon RF Power Transistor for Asymmetrical Doherty  55

3.5.44     Cypress Long Range Bluetooth LEt 55

3.5.45     Peregrine Semi RF Switch for DOCSIS 3.1  56

3.5.46     GLOBALFOUNDRIES Broadens SiGe PA Process Portfolio  56

3.5.47     NXP New NFC Tag and Reader Solutions  56

3.5.48     Qorvo Reverse Path Amplifiers for DOCSIS 3.1  56

3.5.49     Atmel BLE Module for Small Spaces  57

3.5.50     SiBEAM 802.11ad  57

3.6     Other 57

3.6.1       Wi-Fi HaLow for IoT  57

3.6.2       LoRaWAN Demonstrator from ADEUNIS RF Certified  57

3.6.3       Microchip Technology to Acquire Atmel 58

3.6.4       NYU Wireless, Sibeam and Ni Testbed for 5G   58

3.6.5       Sony to Acquire Altair Semi 58

3.6.6       5G Interest and Development Activity Heats Up  58

3.6.7       Intel and Qualcomm Cooperate for 802.11ad Interoperability  59

3.6.8       Qualcomm and DT Demonstrate LAA  60

3.6.9       DelfMEMS Closes Doors  60

3.6.10     New Bluetooth Spec. In Development 60

3.6.11     TSMC Outlines Roadmap  61

3.6.12     Mercury Systems to Acquire Microsemi RF Business Unit 61

3.6.13     US Operators Ask for Licenses to Conduct Tests at 28 GHz  61

Exhibits

Exhibit 2—1               Two-Year Profitability History for RF Component Suppliers. 9

Exhibit 2—2               Companies Posting Significant Losses. 10

Exhibit 2—3               Companies Posting Marginal Profits or Losses. 10

Exhibit 2—4               Companies Posting the Highest Profits. 11

Exhibit 2—5               RF / Wireless Component Mergers, Acquisitions, Divestitures: Q1 ‘16. 14

Exhibit 2—6               RF / Wireless Component Related Start-up Funding. 15

Exhibit 3—1               Twelve-Year History: The Anadigics Sales and Profit Rollercoaster 27

Exhibit 3—2               STMicro’s 2015 Results for DPG.. 41

Exhibit 4—1               Main Companies Covered. 63


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