RF&Wireless射频及无线元器件

Ask the author
Author: Christopher Taylor
Publication Date: 3月 11 2013
Pages: 23
Report Type: Report, Word

相关的数据可视化界面

射频及无线元器件

PA Market in Flux CMOS PAs and Envelope Tracking Emerge as Major Themes at MWC 2013



Please contact us to discuss pricing Contact Us

US and global visitors can buy this report for $1399
UK visitors will be charged £1100

This report is available for individual purchase.

Report Summary:

Qualcomm’s RF360 front-end subsystem for handsets elicited a flurry of power amplifier (PA) and envelope tracking (ET) announcements at MWC ’13 as competitive counterweight, with no fewer than 10 companies releasing new details about how they will support ET to enable better LTE devices. Adoption of ET in LTE handsets has suddenly moved about 18 months closer to reality, with first products likely to appear by late 2013 or early 2014 in production mobile devices. Perhaps paradoxically, new PAs and ET from Qualcomm’s GaAs-oriented competitors will dilute Qualcomm’s new presence in the RF front end, but widely available ET will also improve prospects for CMOS PAs, challenging the dominance of leading GaAs-based PA suppliers Skyworks, RFMD and others.

For more information about our services please contact us or email support@strategyanalytics.com

Let's talk

Now you know a little about us, get in touch and tell us what your business problem is.
Name:
Email:
Telephone:
Country:
Inquiry / Message: