Contents
1. Executive Summary 7
2. Introduction 8
3. MMICs 9
3.1 Business 9
3.1.1 Qorvo Acquires Cavendish Kinetics 9
3.1.2 Qorvo Announces Share Repurchase Program 9
3.1.3 MACOM Reports Q4 and FY 2019 Financials 9
3.1.4 Skyworks Reports Q4 and FY ’19 Financials 9
3.1.5 Analog Devices Reports Q4 and FY ’19 Financials 10
3.1.6 Qorvo Reports Q2 FY ’20 Financials 10
3.2 New Products 10
3.2.1 WIN Semiconductors Offers Sample Kits for its GaN-on-SiC Technology 10
3.2.2 Murata Releases Noise Filters for the 5 GHz Wi-Fi Band 10
3.2.3 Custom MMIC Expands its GaAs-Based Product Portfolio 11
3.2.4 Skyworks Expands Power Amplifier Portfolio 11
3.2.5 Qorvo Supports Network Rollouts with 5G Antenna Technology 11
3.2.6 Custom MMIC Introduces New Sub-harmonic Mixer Family 11
3.2.7 OMMIC’s Introduces New GaN Process Design Kit 11
3.2.8 Skyworks Launches Front-End Module Powering Wi-Fi 6 12
3.3 Other 12
3.3.1 Murata and Resonant Sign Multi-Year Agreement 12
3.3.2 Market Leaders Choose Skyworks Connectivity Modules 12
3.3.3 WIN Semiconductors Celebrates 20 Years of Compound Semiconductor Leadership 13
3.3.4 Filtronic CEO to Step Down 13
3.3.5 OMMIC to Develop Uplink SATCOM Power Amplifier 13
3.3.6 The Semiconductor Industry Association Announces Senior Leadership 13
3.3.7 Akoustis Delivers 60,000 Pre-Production 5.6 GHz BAW Filters 13
3.3.8 Qorvo Unveils Motor Control and Drive SoC for Brushless DC Power Tools 14
3.3.9 Northrop Grumman Delivers 500th Fire Control Radar for the Lockheed Martin F-35 14
3.3.10 Filtronic Expands Hybrid Microelectronics Manufacturing Facility 14
3.3.11 Akoustis Receives Pre-Production Order for Filters 14
3.3.12 Fujitsu Honored with IEEE Milestone for High Electron Mobility Transistor 15
3.3.13 Akoustis Ships Two New 5G XBAW RF Filters 15
3.3.14 Calterah Announces CMOS mmWave Radar SoC 15
4. Power Devices 16
4.1 Business 16
4.1.1 Power Integrations Reports Third-Quarter Financial Results 16
4.1.2 Infineon Reports Q4 and FY ’19 Financials 16
4.2 New Products 16
4.2.1 Kemet Announce KC-Link Capacitor Series 16
4.2.2 Rohm Adopts 4-pin Package for SiC MOSFET Switching 17
4.2.3 II-VI Unveils 200mm Semi-insulating SiC Substrates 17
4.2.4 Navitas GaNFast Power ICs Enable 300W Adapter 17
4.2.5 EPC Expands AEC Q101 Product Family 17
4.2.6 ROHM's Announces 200V IR Schottky Barrier Diodes 18
4.2.7 Nexperia Announces GaN-on-Si FET 18
4.2.8 Maxim Launches SiC Gate Driver 18
4.2.9 On Semiconductor Debuts Two Power Modules for Traction Inverters in EVs 18
4.2.10 Atom Power Launches SiC-based Digital Circuit Breaker 19
4.2.11 Teledyne E2v Unveils Hi-rel 650V GaN HEMT 19
4.2.12 NXP Introduces GaN-on-SiC Transistor for RF Energy 19
4.3 Other 19
4.3.1 Mitsubishi Electric Develops New Trench-type SiC-MOSFET 19
4.3.2 BAE Systems to Scale GaN Technology for Defence MMICs 20
4.3.3 Power Integrations Develops GaN-on-Sapphire HEMT 20
4.3.4 Bosch Develops SiC Targeting EV/HEV Power Electronics 20
4.3.5 Cree & NY CREATES Announce First SiC Wafer Demo at SUNY Poly in Albany 20
4.3.6 EPC Expands Technical Leadership Team 21
4.3.7 Navitas and Baseus Deliver 65W 3-port Wall Charger 21
4.3.8 Odyssey Semiconductor Picks Up Wafer Fab 21
4.3.9 GTAT Gets ISO Certification for CrystX SiC 21
4.3.10 GaN Systems and ON Semi Demo Latest GaN Technology 22
4.3.11 GaN Systems Receives ISO 9001:2015 Certification 22
4.3.12 Comtech Telecom Receives Multiple Contract Awards 22
4.3.13 GaN Foundry IVWorks Raises Series B Funding 22
4.3.14 US Army and Rice University Target Diamond Materials 23
4.3.15 Cree and ABB Announce SiC Partnership 23
4.3.16 Cree and STMicroelectronics Expand SiC Wafer Supply Agreement 23
4.3.17 ZF and Danfoss Seal Strategic Partnership 23
4.3.18 Transmorphic Heteroepitaxy GaN-on-SiC Growth Process Developed 23
4.3.19 Fujitsu Grows Diamond Film to Boost Heat Dissipation Efficiency of GaN HEMT 24
4.3.20 Northrop Grumman Receives Production System Contract 24
4.3.21 Mitsubishi Develops 28 GHz GaN Doherty 5G Power Amplifier 24
4.3.22 II-VI Signs to Develop SiC Substrates for GaN RF Power Amplifiers 24
4.3.23 Dana Shows SiC Inverters 25
4.3.24 Elektro-Automatik Announces SiC High Power Density ELR 25
4.3.25 Modelithics Updates its Component Library to Include Qorvo GaN Products 25
4.3.26 GaN Systems and SPARX Advance GaN in Electric Vehicles 26
4.3.27 Airbus and Boeing Use Transphorm GaN Devices in Power Supplies 26
4.3.28 ON Semi and GaN Systems Announce 300W Adapter Reference Design 26
5. Materials & Equipment 27
5.1 Business 27
5.1.1 IQE Announces Acquisition of 100% of CSDC 27
5.1.2 SOITEC Reports FY’20 Second Quarter Revenues 27
5.1.3 Cornell NanoScale Facility and Plasma-Therm Collaborate on Atomic Layer Etching 27
5.1.4 AIXTRON Sees Rise in Order Intake 27
5.1.5 Onto Innovation Completes Merger 28
5.1.6 RIBER Reports Performance at End-September 2019 28
5.1.7 AXT Announces Third Quarter 2019 Financial Results 28
5.1.8 Axcelis Announces Financial Results for Third Quarter 2019 29
5.1.9 Veeco Instruments Announces Third Quarter Results 29
5.1.10 Atomera Licenses its Quantum-Engineered Material Technology 29
5.1.11 Cabot Microelectronics Reports Q4 and Fiscal Year 2019 Results 29
5.1.12 IQE Trading Update 30
5.1.13 Soitec & Applied Materials to Develop Next-gen SiC Substrates 30
5.1.14 Cadence to Acquire AWR from NI 30
5.1.15 RENA Acquires US-based MEI 31
5.1.16 JCET Enters Into Strategic Agreement with Analog Devices 31
5.2 Contracts 31
5.2.1 EpiWorld Accelerates SiC Commercialization with new AIXTRON Tool 31
5.2.2 Aehr Receives Orders for Test and Burn-in System and WaferPaks™ 31
5.2.3 RIBER Announces MBE System Order 31
5.2.4 Riber Announces Order for Research MBE Machine in Germany 32
5.2.5 memsstar Ships MEMS Production System to University of Freiburg 32
5.3 Other 32
5.3.1 Compound Semiconductor Centre and Kubos Collaborate on GaN 32
5.3.2 SMART Develops Integrated Silicon/III-V Chips 32
5.3.3 Panasonic Teams with IBM on Semiconductor Manufacturing Processes 33
5.3.4 AKHAN Semiconductor Partners with Lockheed Martin 33
5.3.5 StratEdge Offering High Frequency, High Power Assembly Services 33
5.3.6 Fraunhofer Team Makes AlScN Wafer Using MOCVD 33
5.3.7 Advantest Debuts Millimeter Test Solution 34
5.3.8 Saki Corporation Introduces Automated X-ray Inspection 34
5.3.9 Thermo Fisher Scientific Unveils Metrios AX S/TEM 34
5.3.10 SUSS MicroTec, Announces Collaboration with BRIDG 34
5.3.11 Teradyne Delivers J750 Semiconductor Test System 35
5.3.12 Graphene Specialist Paragraf Increases Series A Funding 35
5.3.13 ElevATE Semiconductor Fills Senior Management Positions 35
5.3.14 Smiths Interconnect Opens Advanced Qualification & Test Lab in Scotland 35
5.3.15 BES Completes Compound Semiconductor Innovation Centre 35
6. Silicon Devices 37
6.1 Business 37
6.1.1 TSMC Files Multiple Lawsuits against GLOBALFOUNDRIES 37
6.1.2 TSMC Reports Q3 FY ’19 Financials 37
6.1.3 TI Reports Q3 FY ’19 Financials 37
6.1.4 Silicon Labs Announces Third Quarter 2019 Results 37
6.1.5 Cypress Reports Q3 FY ’19 Financials 38
6.1.6 NXP Reports Q3 FY ’19 Financials 38
6.1.7 Fujitsu Reports Q2 FY ‘19 Financials 38
6.1.8 Maxim Reports Q1 FY ’20 Financials 38
6.1.9 Sony Reports Q2 FY ’20 Financials 38
6.1.10 UMC Reports Q3 FY ’19 Financials 39
6.1.11 Microchip Reports Q2 FY ’20 Financials 39
6.1.12 Qualcomm Reports Q4 and FY ’19 Financials 39
6.1.13 TowerJazz Reports Q3 FY ’19 Financials 39
6.1.14 Panasonic Sells its Semiconductor Business to Nuvoton 39
6.1.15 TowerJazz Will Not Sell Its Half of the Panasonic Image Sensor Partnership 40
6.1.16 Analog Devices Files Patent Infringement Lawsuit against Xilinx 40
6.1.17 NXP Completes Acquisition of Marvell’s Wi-Fi and Bluetooth Connectivity Assets 40
6.1.18 MIRISE Technologies Will Develop Semiconductors 40
6.2 New Products 41
6.2.1 NXP Unleashes All-in-One 5G mMIMO RF Power Amplifier Modules 41
6.2.2 Teledyne e2v HiRel Releases Radiation Tolerant RF Switch 41
6.3 Other 41
6.3.1 Murata Manufacturing and Resonant Enter into an Agreement 41
6.3.2 Samsung Electronics Develops 2-Layer 3D-TSV Chip Packaging Technology 41
6.3.3 X-FAB Adds Non-Volatile Memory Functions to nm BCD-on-SOI Platform 42
6.3.4 Synopsys Announces Die-to-Die PHY IP 42
6.3.5 Synopsys Ships More Than 3,000 HAPS-80 Prototyping Systems 42
6.3.6 Global Semiconductor Sales Increase in September 42
6.3.7 Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter 42
6.3.8 Moortec IP Embedded in Automotive Radar-on-chip Device 43
6.3.9 Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 43
6.3.10 Global Semiconductor Sales Mixed 43
6.3.11 Teledyne e2V HiRel Release Radiation Tolerant Limiter 43
6.3.12 Cobham Releases RISC-V Processor IP Core 44
6.3.13 Lattice Picks FD-SOI and Redesigns FPGAs for Embedded Vision and Edge AI 44
6.3.14 SEMI and VLSI Research Unveil Semiconductor Manufacturing Industry Report 44
7. Optoelectronic Devices 45
7.1 Business 45
7.1.1 MagnaChip Announces Third Quarter 2019 Financial Results 45
7.1.2 POET Closes DenseLight Sale to China 45
7.1.3 nLIGHT Acquires Nutronics 45
7.1.4 POET Technologies Reports Third Quarter 2019 Results 45
7.2 Datacom 46
7.2.1 OMC Debuts Fiber-optic LED Emitter and Moulded Backlight Series 46
7.2.2 Inphi Sampling First 400ZR QSFP-DD Transceiver 46
7.3 Other 46
7.3.1 Marktech Reflective Sensors Feature 0.5-1.5mm Short Detection Distance 46
7.3.2 Compound Photonics and Plessey Partner on micro-LED Displays 46
7.3.3 BluGlass Debuts GaN Laser Business Unit 47
7.3.4 Marktech Broadband Hybrid Silicon-InGaAs Photodetectors 47
7.3.5 II-VI Introduces Aspheric Sapphire Optics 47
7.3.6 Artilux Unveils GeSi Wide Spectrum 3D Sensor 47
7.3.7 Renesas Launches Photocouplers 48
8. How Can We Help You? 49