Author: Eric Higham


Publication Date: 2月 21 2019


Pages: 48


Report Type: Report, Word



 高级半导体

Compound Semiconductor Industry Review: October - December 2018




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Report Summary:

Financial results for this sector of the electronics industry are as close to universally positive as they get, but operating income was generally flat or declining. This quarter has seen substantial consolidation activity in the optical segment, with companies positioning for future opportunities. The material segment is also developing new technologies for next generation applications.

Table of Contents

1.      Executive Summary

2.      Introduction

3.      MMICs

3.1     Business

3.1.1       Skyworks Reports Q4 and FY 2018 Financials

3.1.2       MACOM Reports Q4 and FY 2018 Financials

3.2     New Products

3.2.1       Custom MMIC Releases Wideband GaN LNA

3.2.2       Custom MMIC Launches DC-30 GHz GaAs Driver Amplifier

3.2.3       Skyworks Launches Power Amplifier for Cellular 4G and 5G Infrastructure

3.2.4       Qorvo Launches 28 GHz GaN Front-end Module

3.2.5       Qorvo Announces 802.11ax 5 GHz FEM

3.2.6       MACOM Introduces Low Phase Noise Amplifier

3.3     Other

3.3.1       Skyworks Powers Connected Lighting for Revolutionary Smart Cities

3.3.2       Akoustis Names Chief Product Officer

3.3.3       Teledyne Microwave Solutions Wins $7.5 Million Award

3.3.4       Sanan IC Achieves Automotive Quality Management System Certification

3.3.5       Akoustis Announces 5.2 GHz Wi-Fi Pre-Production Order

3.3.6       FMV Contracts with Saab for GaN-based AESA Radars

3.3.7       Lockheed Martin Readies Its Latest L-Band Radar for Production

4.      Power Devices

4.1     Business

4.1.1       Cree Enters SiC Wafer Supply Agreement

4.1.2       Littelfuse Completes Acquisition of Monolith Semiconductor

4.1.3       Infineon Reports Q4 and FY 2018 Financials

4.1.4       Infineon Acquires Silicon Carbide Specialist Siltectra

4.1.5       3-5 Power Electronics Secures New Financing

4.2     New Products

4.2.1       Integra Technologies Releases L-band RF Power Amplifier

4.2.2       Integra Offers GaN-on-SiC Transistor Evaluation Kits

4.2.3       TI Announces 600V GaN FET Power Stages

4.2.4       Ampleon Develops 250W Dual-stage LDMOS Modules

4.2.5       ON Semiconductor Launches Power Modules

4.2.6       UnitedSiC Introduces New FET Series

4.2.7       Exagan Develops High Power-Conversion Solutions

4.2.8       Comtech Introduces GaN Solid-State Power Amplifier

4.2.9       SSDI Introduces GaN FETs for Power Electronics Applications

4.3     Other

4.3.1       Raytheon Supplying GaN Technology for GEM-T Missile

4.3.2       U.S. Army Extends Lockheed Martin’s AN/TPQ-53 Radar Range Contract

4.3.3       Raytheon Advances in US Army’s Competition

4.3.4       Saab Gets US Navy Contract for GaN-based Active Aperture Array Radar

4.3.5       DARPA Awards GaN Millimeter Wave Project to HRL Laboratories

4.3.6       Qorvo Awarded Air Force GaN Contract

4.3.7       Plextek RFI Designs Power Amplifier Module for Astro Digital

4.3.8       IGaN and SilTerra Develop 200 mm GaN-on-Si Wafer D-MISHEMT

4.3.9       Mitsubishi Electric and the University of Tokyo Improve SiC Power Devices

4.3.10     Transphorm Reaches GaN Power Device Shipping Milestone

4.3.11     Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

5.      Materials & Equipment

5.1     Business

5.1.1       Riber Reports Third Quarter Revenues

5.1.2       AXT Announces Third Quarter 2018 Financial Results

5.1.3       Axcelis Announces Financial Results for Third Quarter 2018

5.1.4       Veeco Reports Third Quarter 2018 Financial Results

5.1.5       IQE Issues Trading Update and Comments on VCSEL Supply Chain

5.1.6       Applied Materials Announces Fourth Quarter and Fiscal Year 2018 Results

5.1.7       Lam Research Corporation Announces Resignation of CEO

5.1.8       KLA-Tencor and Orbotech Continue to Pursue Merger Clearance

5.2     Contracts

5.2.1       FBH Selects Solstice S8 for Automated Plating and Solvent Processes

5.2.2       EpiGaN Expands GaN Power Production with AIXTRON AIX G5+ C

5.2.3       InnoScience Powers GaN Development with Aixtron

5.2.4       UNIQORN to Develop Quantum Tech for Mass Market

5.2.5       LayTec Ships EpiTT Band Edge Tool for MBE of VCSELs

5.2.6       Ferdinand Braun Institut Chooses ClassOne for Wet Processing Tools

5.2.7       RIBER Receives Order for Research MBE System

5.2.8       RIBER Announces Order for MBE 49 Production System

5.3     Other

5.3.1       IQE Appoints New Chief Financial Officer

5.3.2       Compound Semiconductor Centre Wins Collaboration Title

5.3.3       Leti and Taiwan’s NARLabs to Collaborate on R&D

5.3.4       II-VI and Sumitomo Electric Device Innovations Establish Strategic Collaboration

5.3.5       Linton Crystal Software Improves Melt Gap Management

5.3.6       Compound Semiconductor Partners to Work on Quantum Technologies

5.3.7       IHP and EVG Cooperate on Covalent Wafer Bonding Technologies

5.3.8       Applied Materials to Address Moore’s Law Challenges

5.3.9       QMC Establishes Quantum Dot Production in India

5.3.10     Thermco Opens Second UK Manufacturing Facility

5.3.11     II-VI Incorporated Introduces Scandium Recovery Technology

5.3.12     Thermal Test Chip Wafers Available In 8" Wafer Form

5.3.13     MagnaChip Semiconductor Appoints New Chairman of the Board

5.3.14     CST Global Appoints R&D Program Manager

5.3.15     Silicon Contamination Found to Hinder Commercial Impact of Graphene

5.3.16     CEA-Leti and Silvaco to Develop Gate-All-Around Spice Compact Models

5.3.17     EVG Unveils BONDSCALE Fusion Wafer Bonder

5.3.18     Disco Launches High-Precision Fully Automatic 8-Inch Wafer Grinder

5.3.19     Fab Equipment Spending Reverses Course as Growth Outlook Revised Downward

5.3.20     North American Semiconductor Equipment Industry Posts November 2018 Billings

6.      Silicon Devices

6.1     Business

6.1.1       TSMC Announces Results for Q3 FY ‘18

6.1.2       UMC Release Q3 FY ’18 Financial Results

6.1.3       Wingtech Technology to Buy Nexperia

6.1.4       TowerJazz Announces Q3 FY 2018 Financial Results

6.1.5       Maxim Reports Q1 FY ’19 Results

6.1.6       Analog Devices Reports Q4 and FY ’18 Financials

1.1.1       IBM Expands Strategic Partnership with Samsung

6.2     New Products

6.2.1       pSemi Announces Volume Production of the 55 GHz Digital Step Attenuator

6.2.2       Renesas SOTBTM Energy Harvesting Chipset Uses Soitec SOI Wafers

6.2.3       MagnaChip Offers Bipolar-CMOS-DMOS Process Technology

6.2.4       Mobile Semiconductor Introduces FDX (FDSOI) ULP Memory Compiler

6.3     Other

6.3.1       ON Semiconductor Expands Board of Directors

6.3.2       Synopsys Announces Support TSMC Advanced Packaging Technologies

6.3.3       GlobalFoundries Adds Nine Firms to RFwave Partner Program

6.3.4       Teledyne e2v Hi-Rel Expands Its Microelectronics Portfolio

6.3.5       imec Spin-off Unveils 60 GHz Phased Array System with 256 Antenna Elements

6.3.6       Samsung Launches 7nm EUV Process

6.3.7       China Keeps Global Semiconductor Market Going Strong

6.3.8       Third Quarter Silicon Wafer Shipments Set New Quarterly Record

6.3.9       Thin Film Electronics Appoints New CEO

6.3.10     North American Semiconductor Equipment Industry Posts October 2018 Billings

6.3.11     GLOBALFOUNDRIES Announces 300mm SiGe Foundry Technology

6.3.12     CEA-Leti Extends 300mm Wafer Line

6.3.13     KERI using TowerJazz’s 0.18um SOI Power Platform

6.3.14     imec Grows WS2 on 300mm Wafers

6.3.15     Synopsys and imec Complete CFET Modelling

6.3.16     Sivers IMA & Ampleon Collaborate on Millimeter Wave Chips

6.3.17     Global Semiconductor Sales Up 9.8% Year-to-Year in November

7.      Optoelectronic Devices

7.1     Business

7.1.1       Infinera Closes Acquisition of Coriant

7.1.2       EMCORE Corporation Announces Preliminary Financial Results for Q4 ‘18

7.1.3       NTT DOCOMO Ventures Invests in QD Laser

7.1.4       Cree Reports Q1 FY ’19 Financial Results

7.1.5       Fujitsu Announces Q2 FY ’18 Results

7.1.6       Sony Reports Q2 FY ’19 Financial Results

7.1.7       II-VI Reports Q1 FY ’19 Financials

7.1.8       Lumentum Reports Q1 FY ’19 Financials

7.1.9       SEI Reports Q2 FY ’18 Financials

7.1.10     II-VI to Expand Manufacturing Footprint in China

7.1.11     II-VI to Acquire Finisar

7.1.12     POET Technologies Reports Third Quarter 2018 Financial Results

7.1.13     Finisar Announces Second Quarter of Fiscal 2019 Financial Results

7.1.14     Lumentum Completes Oclaro Acquisition

7.1.15     Excelitas Technologies to Acquire Axsun Technologies

7.1.16     WaveOptics and Corning Sign Long-Term Supply Deal for AR Optics

7.1.17     TRUMPF Acquires Laser Diode Division of Philips

7.1.18     Cisco Announces Intent to Acquire Luxtera

7.1.19     Kaiam Makes Livingston Workforce Redundant

7.2     Datacom

7.2.1       EMCORE Awarded Inertial Navigation Systems Contract

7.2.2       POET Technologies Receives Optical Interposer Orders

7.2.3       Philips Photonics Ships One Billionth VCSEL

7.2.4       European Pilot Line Will Incubate Future Photonics Products

7.2.5       OSI Laser Diode Develops 905nm Pulsed Laser with Far Field Beam

7.3     Other

7.3.1       Vishay Intertechnology Develops Proximity Sensor

7.3.2       UTC Aerospace Systems Develops SWIR Camera

7.3.3       Device Consortium Wins Eurostars Program Funding

7.3.4       EFFECT Photonics Completes Series-B Financing

7.3.5       Osram Develops Edge-emitting Laser for Automotive LiDAR

7.3.6       NIST Finds That Silicon Photonic Sensors Survive High Radiation Doses

7.3.7       CST Global Launches Forum for Commercializing Photonics Technologies

7.3.8       KETS Quantum Security Lands Seed Funding for Chip-scale QKD

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