Gallium_Arsenide高级半导体

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Author: Eric Higham
Publication Date: 5月 27 2021
Pages: 57
Report Type: Report, Word

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高级半导体

Compound Semiconductor Industry Review: January-March 2021




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Report Summary:

Financial results reported in this quarter show that the COVID recovery continues and the industry is in good operational shape. Semiconductor sales and silicon shipments were up in 2020, showing how fast the recovery has been. In the supply chain, II-VI won the battle to buy Coherent and Cree divested its remaining LED business with Wolfspeed as the business entity going forward.
Table of Contents

Contents
1. Executive Summary 9
2. Introduction 10
3. MMICs 11
3.1 Business 11
3.1.1 Arcline Investment Management Forms Quantic 11
3.1.2 MACOM Reports Q1 FY ‘21 Financials 11
3.1.3 Skyworks Reports Q1 FY ’21 Financials 11
3.1.4 Qorvo Reports Q3 FY ’21 Financials 11
3.1.5 Qualcomm Reports Q1 FY ’21 Financials 12
3.1.6 Microchip Reports Q3 FY ’21 Financials 12
3.1.7 Analog Devices Reports Q1 FY ’21 Financials 12
3.1.8 Broadcom Reports Q1 FY ’21 Financials 12
3.1.9 Semtech Reports Q4 and FY ’21 Financials 12
3.2 Contracts 13
3.2.1 Filtronic to Supply Battlefield Ready Radio Communications Hardware 13
3.2.2 Akoustis Receives Volume Order for XBAW Coexistence Filter Solutions 13
3.2.3 Akoustis Announces Design Win for XBAW Filters 13
3.2.4 Sivers Semiconductors Announces Millimeter Wave Orders 14
3.3 New Products 14
3.3.1 Renesas Introduces 60W Wireless Power Receiver IC 14
3.3.2 Qorvo Introduces 5G Base Station Low Noise Amplifiers 14
3.3.3 Guerrilla RF Launches InGaP HBT Power Amplifiers 15
3.3.4 Qorvo Introduces Wi-Fi 6E FEMs 15
3.3.5 Skyworks Expands Power Amplifier Portfolio 15
3.3.6 API Tech Introduces a 30 GHz Chip Attenuator 15
3.3.7 Qorvo Introduces GaAs I/Q Mixers 16
3.3.8 RFHIC Introduces a C-band Power Amplifier 16
3.3.9 Advantech Wireless Introduces SSPAs and BUCs 16
3.3.10 Qorvo Launches Smart Home Device Controller 16
3.3.11 Menlo Micro Ideal Switch Technology Exceeds 95dBm IP3 16
3.3.12 Fairview Microwave Releases New SMT Noise Sources 17
3.4 Other 17
3.4.1 Resonant XBAR RF Filter Technology Has Over 150 Patents 17
3.4.2 Resonant Ships 6.9 Million RF Filters in Q4 2020 17
3.4.3 Mini-Circuits Awarded Patent for 60 GHz LTCC Packaging Technology 18
3.4.4 Contactor and Probe Head Platform Targets 5G RF Testing 18
3.4.5 Skyworks Collaborates with Xilinx on 5G Power Amplifiers 18
3.4.6 Skyworks Ships Over 1 Million Units of First Small-Cell Base-station 5G PA 18
3.4.7 GaN MEMS Resonator Operates at High Temperature 19
3.4.8 Akoustis Unveils Tandem Wi-Fi 6E BAW Coexistence Filter Solutions 19
3.4.9 Richardson Electronics Announces Agreement with Quantum Microwave 19
3.4.10 David Aldrich Joins Board of Directors of Mobix Labs 19
3.4.11 Microchip Technology Announces Board Changes 20
3.4.12 Qorvo RF Products Enable the Perseverance Rover 20
3.4.13 GLOBALFOUNDRIES Partners with Bosch 20
3.4.14 Quantic Electronics Acquires Planar Monolithic Industries 20
3.4.15 Qorvo Increases RF Fusion20 Shipments 21
4. POWER DEVICES 22
4.1 Business 22
4.1.1 SK Invests in Yes Power Technix 22
4.1.2 Transphorm Reports Fourth Quarter 2020 Results 22
4.1.3 Nexperia and UAES Partner on Automotive Power Devices 22
4.2 New Products 23
4.2.1 Monolithic Power Systems Launches DC-DC Power Modules 23
4.2.2 Empower RF Introduces GaN-on-SiC Amplifier 23
4.2.3 Infineon Launches 650V CoolSiC Hybrid IGBT Discrete Family 23
4.2.4 Empower RF Introduces C-Band GaN-on-SiC Power Amplifier 24
4.2.5 Navitas Announces GaNFast Power IC 24
4.2.6 ROHM Expands P-channel MOSFET Portfolio 24
4.2.7 II-VI Introduces SiC Ceramic Materials 24
4.2.8 Nexperia Launches Compact Half-Bridge Auto MOSFETs 25
4.2.9 EPC Qualifies 65V eGaN FET for Automotive LiDAR Systems 25
4.2.10 Knowles Introduces Single Layer Capacitor for Amplifier Applications 25
4.2.11 Infineon Launches 650V CoolSiC Hybrid Discrete for Automotive 25
4.2.12 Toshiba Launches Five 650V Superjunction Power MOSFETs 26
4.2.13 Infineon Technologies Launches StrongIRFET 2 Power MOSFETs 26
4.2.14 Toshiba Low-Profile LDOs Deliver Low Output Voltage Noise 26
4.2.15 Siemens and Infineon Partner on Converters for Rail Transport 26
4.2.16 Alpha and Omega Semiconductor Announces Bridge Rectifier 27
4.2.17 EPC Expands Laser Driver IC Family 27
4.3 Other 27
4.3.1 EPC Releases Latest EGaN Reliability Report 27
4.3.2 MACOM and U.S. Air Force Enter into Development Agreement 27
4.3.3 UKRI Funds Development of a 200mm 650V GaN HEMT Foundry Process 28
4.3.4 Leibniz University and TI Develop GaN Power Converter 28
4.3.5 Key Foundry Offers New BCD Process for Semiconductors 28
4.3.6 EPC Announces 48V to 12V Demo Board 29
4.3.7 Comtech Xicom Receives IFC Order 29
4.3.8 Northrop Grumman Awarded G/ATOR Contract Modification 29
4.3.9 Teledyne e2v and Integra Develop GaN Transistors for Space 29
4.3.10 Toshiba to Build 300mm Power Devices Fab 30
4.3.11 Shanghai Lingang Issues Plan for Semiconductor Support 30
5. MATERIALS & EQUIPMENT 31
5.1 Business 31
5.1.1 Axcelis Updates and Increases Q4 2020 Guidance 31
5.1.2 IQE Announces FY 2020 Trading Update 31
5.1.3 ASML reports 2020 Fourth-Quarter and Full-Year Results 31
5.1.4 SOITEC Reports Fy’21 Third Quarter Revenues 31
5.1.5 MKS Instruments Reports Financial Results 32
5.1.6 Teradyne Reports Fourth Quarter and Fiscal Year 2020 Results 32
5.1.7 Lam Research Reports Results for the Quarter 2020 32
5.1.8 Riber Reports 2020 Full-Year Revenues 32
5.1.9 Global Semiconductor Sales Increase in 2020 33
5.1.10 2020 Global Silicon Revenue Remains Stable 33
5.1.11 Veeco Reports Fourth Quarter and Fiscal Year 2020 Results 33
5.1.12 AXT Reports Fourth Quarter and Fiscal Year 2020 Results 33
5.1.13 AIXTRON Reports Fiscal Year 2020 Results 34
5.1.14 Axcelis Announces Q4 and Full Year Financial Results 34
5.1.15 IQE Reports 2020 Full Year Results 34
5.2 Contracts 34
5.2.1 Riber Announces Order for a Research MBE Machine in Asia 34
5.2.2 Axcelis Ships Purion H200 High Current Implanter 35
5.2.3 Aehr Receives WaferPak Orders 35
5.2.4 Aehr Announces Order from Silicon Photonics Customer 35
5.2.5 ASML Receives Order from SK Hynix 35
5.2.6 SMIC Places Orders with ASML 36
5.2.7 Inseto Provides Bonder for Compound Semi Projects 36
5.2.8 Epiluvac Supplies CVD Reactors to Polish Institute 36
5.2.9 Axcelis Ships Purion Systems to CMOS Image Sensor Manufacturers 36
5.3 Other 37
5.3.1 Global Semiconductor Sales Increase in November 37
5.3.2 Veeco to Collaborate on GaN Power and 5G Device Production 37
5.3.3 North American Semiconductor Equipment Billings Increase 37
5.3.4 Lam Research Launches Vantex Etch Technology 37
5.3.5 AKHAN Names New Chief Marketing Officer 38
5.3.6 Oxford Instruments Plasma Technology Relocates 38
5.3.7 Eta Research Announces GaN wafers for Laser Diode Manufacturers 38
5.3.8 Axcelis Announces Shipment of Purion SiC Power Series Implanter 38
5.3.9 StratEdge Increases Manufacturing Capacity 39
5.3.10 AMEC Introduces Primo Twin-star System 39
5.3.11 SweGaN Brings QuanFINE GaN-on-SiC Epi to ESA Project Kassiopeia 39
5.3.12 Swansea University Gets Funding for SiC Power Device Pilot Line 39
6. Silicon Devices 40
6.1 Business 40
6.1.1 TSMC Reports Q4 and FY ‘20 Financials 40
6.1.2 Maxim Reports Q2 FY ’21 Financials 40
6.1.3 UMC Reports Q4 and FY ’20 Financials 40
6.1.4 Seiko-Epson Reports Q3 FY ‘21 Financials 41
6.1.5 NXP Reports Q4 and FY ’20 Financials 41
6.1.6 On Semiconductor Reports Q4 and FY ’20 Financials 41
6.1.7 Infineon Reports Q1 FY ’21 Financials 41
6.1.8 Comcores Sells Wireless Assets to Analog Devices 41
6.1.9 Tower Semiconductor Reports Q4 and FY ’20 Financials 42
6.1.10 Silicon Labs Looking to Sell Analog Business 42
6.1.11 Global Semiconductor Sales Increase 13.2% in January 42
6.1.12 AI Commission Calls for Federal Investments in Semiconductors 42
6.1.13 SkyWater to IPO 43
6.2 New Products 43
6.2.1 NXP Introduces 4x4 Wi-Fi 6E SOC 43
6.2.2 Ams Launches Proximity Sensor 43
6.2.3 Ams Announces Rotary Position Sensor 43
6.2.4 Microchip Technology Develops Space-Qualified Power Converters 44
6.3 Other 44
6.3.1 Magnachip Launches New Brand Identity 44
6.3.2 Cree to Rename as Wolfspeed 44
6.3.3 SK Hynix Completes Latest Fab 45
6.3.4 Renesas to Acquire Dialog Semiconductor 45
6.3.5 imec Demonstrates 20nm Pitch Line/Space Resist Imaging 45
6.3.6 U.S. DoD Partners with GLOBALFOUNDRIES on Secure Chips 45
6.3.7 CEA-Leti and Dolphin Design Develop Adaptive Back-bias for FD-SOI 46
6.3.8 Tower Semiconductor to Expand Manufacturing Capabilities 46
6.3.9 pSemi Opens New Design Center in India 46
6.3.10 GlobalFoundries to Increase Production at Three Fabs 46
6.3.11 X-FAB Collaborates with IHP on SiGe BiCMOS Technology 47
6.3.12 Tower Semiconductor Introduces Galvanic Isolation Technology 47
7. Optoelectronics I: LEDs, Datacoms & Other 48
7.1 Business 48
7.1.1 Lumentum Provides Preliminary Second Quarter 2021 Financials 48
7.1.2 Cree Reports Q2 FY ’21 Financials 48
7.1.3 SEI Reports Q3 FY ’20 Financials 48
7.1.4 Sony Reports Q3 FY ’21 Financials 48
7.1.5 II-VI Offers to Acquire Coherent for $260 per Share 49
7.1.6 NeoPhotonics Reports FY 2020 Results 49
7.1.7 Cree Completes Sale of its LED Business 49
7.1.8 Lumentum Raises Coherent Acquisition Offer 49
7.1.9 Coherent Board Accepts II-VI Acquisition Proposal 50
7.2 Datacom 50
7.2.1 Seoul Viosys Begins Mass Production of 25Gbps VCSELs 50
7.2.2 EMCORE Ships L-Band Fiber Optic Links 50
7.2.3 Teledyne LeCroy Announces SierraNet™ M648 51
7.2.4 Rockley Closes Additional Funding Round 51
7.2.5 POET Technologies Introduces LightBar-C™ Product 51
7.2.6 Rockley Selects Synopsys for Silicon Photonics Design Solutions 51
7.2.7 POET Making Progress on Super Photonics Xiamen Joint Venture 52
7.2.8 NeoPhotonics Demonstrates QSFP-DD Pluggable Coherent Module 52
7.3 Other 52
7.3.1 Tower Semiconductor is Participating in the LUMOS Program 52
7.3.2 NY CREATES Announces Interim Leadership for Aim Photonics 52
7.3.3 II-VI Develops Double-Junction VCSEL Arrays 53
7.3.4 II-VI Introduces Multi-Wavelength Laser Modules for Life Sciences 53
7.3.5 II-VI Unveils VCSEL Flood Illuminator Modules 53
7.3.6 NeoPhotonics 400G ZR Modules Support Operation up to 800C 53
7.3.7 Lynred Developing Near-IR Detectors 54
7.3.8 Vector Photonics to Work with QD Laser in BLOODLINE Project 54
7.3.9 imec Develops Optomechanical Ultrasound Sensor 54
7.3.10 Intevac to Develop SWIR High-Energy Laser Sensor 55
8. Analyst Contacts 56
 
 

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