Gallium_Arsenide高级半导体

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Author: Eric Higham
Publication Date: 5月 06 2022
Pages: 66
Report Type: Report, Word

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高级半导体

Compound Semiconductor Industry Review: January - March 2022



Report Summary:

Financial results in the semiconductor industry continue to be overwhelmingly positive. The silicon sector is not showing impacts from shortages, yet, but the optical segment seems to be facing headwinds from trade sanctions with China and Huawei. The quarter saw substantial product development and announcements from the power electronics segment with a particular focus on compound semiconductors.
Table of Contents

Contents
1. Executive Summary 10
2. Introduction 11
3. MMICs 12
3.1 Business 12
3.1.1 Comtech Rejects Offer from Acacia Research Corporation 12
3.1.2 MACOM Reports Q1 FY ‘22 Financials 12
3.1.3 Akoustis Reports Record Revenue for Second Quarter 12
3.1.4 Qorvo Reports Q3 FY ’22 Financials 12
3.1.5 Skyworks Reports Q1 FY ’22 Financials 13
3.1.6 Murata to Acquire Resonant 13
3.1.7 Analog Devices Reports Q1 FY ’22 Financials 13
3.2 Contracts 13
3.2.1 Akoustis Announces Wi-Fi Design Wins 13
3.3 New Products 14
3.3.1 Guerrilla RF Announces Power Amplifiers 14
3.3.2 Qorvo Wi-Fi 6E FEMs Cover the Full 6 GHz Band 14
3.3.3 Qorvo Introduces Wideband Power Amplifiers 14
3.4 Other 15
3.4.1 Comtech Announces New CEO 15
3.4.2 Fraunhofer IAF Director Steps Down 15
3.4.3 Quantum Microwave to Distribute Raytheon Parametric Amplifier 15
3.4.4 MACOM Achieves AS9100D Aerospace Certification 15
3.4.5 Skyworks Expands Board of Directors 16
3.4.6 Skyworks Appoints New Board Member 16
3.4.7 RFMW Announces Global Distribution Agreement with Menlo Micro 16
3.4.8 Qorvo Biotechnologies Receives NIH Contract 16
3.4.9 Qorvo Selects Cadence Design Systems for SHIP-RF Program 17
3.4.10 Nestwave Appoints New Member to Board of Directors 17
3.4.11 Qorvo Expands Presence in France 17
4. POWER DEVICES 18
4.1 Business 18
4.1.1 Wolfspeed Reports Q2 FY ’22 Financials 18
4.1.2 Power Integrations Reports Financial Results 18
4.1.3 Navitas Reports Q4 2021 Financial Results 18
4.2 Contracts 19
4.2.1 Navitas’ GaN IC Powers OPPO’s Fast Charger 19
4.3 New Products 19
4.3.1 EPC Announces 12V – 48V DC-DC Converter Demo Board 19
4.3.2 GaN Systems Introduces GaN Charger Design 19
4.3.3 SkyWater and Applied Novel Devices Announce Transistor Technology 19
4.3.4 Magnachip Expands SJ MOSFET Portfolio 20
4.3.5 EPC Space Announces Demo Boards for Rad-hard GaN Power Devices 20
4.3.6 EPC Makes GaN Power Bench Suite of Design Tools Available 20
4.3.7 Qorvo Announces Motor Control Reference Design 21
4.3.8 EPC Announces Bidirectional Converter 21
4.3.9 Toshiba Launches 1200V and 1700V SiC MOSFET Modules 21
4.3.10 Vishay Introduces N-Channel MOSFETs 22
4.3.11 Power Integrations Introduces 1700V Switching Power Supply ICs 22
4.3.12 Infineon Launches XHP 2 CoolSiC Power Module 22
4.3.13 TDK-Lambda Expands AC-DC Power Supply Offerings 22
4.3.14 GaN Systems Displays GaN Chargers at APEC 23
4.3.15 McLaren Applied Announces SiC-based Inverter 23
4.3.16 Teledyne HiRel Announces Space-Screened 650V, 60A GaN HEMT 23
4.3.17 EPC Announces Rad-hard Transistor for Space Applications 24
4.3.18 Cambridge GaN Devices Debuts First Commercial Products 24
4.3.19 Microchip Expands SiC Portfolio 24
4.3.20 ROHM Starts Production of 150V GaN HEMTs 24
4.3.21 Infineon Launches Optimized 650V CoolSiC MOSFETs 25
4.4 Other 25
4.4.1 Navitas Opens GaN IC Design Center Dedicated to Electric Vehicles 25
4.4.2 A*STAR and Soitec Collaborate on SiC Semiconductors 25
4.4.3 Navitas Next GaN IC Powers vivo’s iQOO 9 Pro Smartphone 26
4.4.4 Innoscience Launches Operations in USA and Europe 26
4.4.5 EPC Releases Phase 14 Report on GaN Reliability 26
4.4.6 II-VI Qualifies 1200V SiC MOSFET Platform 26
4.4.7 German Consortium Develops Gallium Nitride Inverters 27
4.4.8 NexGen Appoints Chief Systems Officer 27
4.4.9 II-VI Licenses Diamond Technology from Element Six 27
4.4.10 GaN Systems Opens New Office Campus at Hsinchu Science Park 28
4.4.11 Cambridge GaN Devices Launches GaN Project 28
4.4.12 Navitas Issues First GaN Sustainability Report 28
4.4.13 ARPA-E’s OPEN 2021 Program Makes Award to MIT 29
4.4.14 Infineon Expands Malaysian Facility 29
4.4.15 Infineon Names New Chief Operations Officer 29
4.4.16 Navitas and UGREEN Announce GaNFast™ Global Marketing Program 29
4.4.17 Transphorm to Demonstrate 99% Efficiency Power Switching 30
4.4.18 Lucid Air EV Charging Powered by Rohm SiC MOSFET 30
4.4.19 NXP and Hitachi Energy to Accelerate SiC Adoption in E-mobility 30
4.4.20 GaN Systems and GSR Announce Power Supply Field Trial 31
4.4.21 II-VI Accelerates Investment in Silicon Carbide 31
4.4.22 Navitas Powers Smartphone Charging Technology from Realme 31
4.4.23 Wolfspeed Appoints VP 31
4.4.24 Sandia GaN Diode With 6.4 kV Breakdown 32
4.4.25 Navitas Announces 20-year Warranty for GaN ICs 32
4.4.26 Power Integrations Unveils Quasi-resonant PFC IC 32
4.4.27 NXP Develops RF GaN Power Transistors for Active Antenna Systems 32
5. MATERIALS & EQUIPMENT 33
5.1 Business 33
5.1.1 AXT Announces Formal Application for Subsidiary IPO 33
5.1.2 IQE Pre-close Trading Update 33
5.1.3 Lam Research Reports Financial Results 33
5.1.4 MKS Instruments Reports Fourth Quarter and Full Year 2021 Results 33
5.1.5 Soitec Reports Third Quarter FY 22 Results 34
5.1.6 IVWorks Acquires Saint-Gobain’s GaN Wafer Business 34
5.1.7 Riber Announces 2021 Financial Results 34
5.1.8 Axcelis Announces Financial Results 35
5.1.9 GlobalWafers to Expand Capacity Following Failed Siltronic deal 35
5.1.10 Veeco Reports Fourth Quarter and Fiscal Year 2021 Results 35
5.1.11 AXT Announces Financial Results 35
5.1.12 Akhan Raises Funds to Boost Diamond Production 36
5.1.13 AIXTRON Reports Strong Growth in 2021 36
5.1.14 EV Group and Teramount Collaborate on Packaging Technologies 36
5.2 Contracts 37
5.2.1 Axcelis Technologies Announces Purion M Shipments 37
5.2.2 Veeco Wet Processing System Qualified for Memory Applications 37
5.2.3 Veeco Receives Multi-Tool Order for Optoelectronic Components 37
5.2.4 RIBER Receives MBE System Order 37
5.2.5 Riber Receives Order from University of Arkansas 38
5.2.6 Veeco Ion Beam Deposition System Chosen for EUV Mask Blanks 38
5.2.7 ACM Research Receives Orders 38
5.2.8 Axcelis Announces Multiple Shipments of Purion Implanters 39
5.2.9 Riber Announces MBE Compact 21 System Sale 39
5.2.10 Axcelis Announces Purion High Energy System Shipments 39
5.3 Other 39
5.3.1 Dolphin Design Opens Processing Center in Singapore 39
5.3.2 Axcelis Announces Purion H200 Shipments 40
5.3.3 Gelest Names New President 40
5.3.4 EV Group Announces Multi-Functional Optical Platform 40
5.3.5 TNSC and NC State Collaborate on GaN Optoelectronic Technologies 41
5.3.6 UK CSA Catapult Appoints Non-executive Director 41
5.3.7 IQE Establishes New ESG Board Committee 41
5.3.8 ACM Research Strengthens Wet Processing Portfolio 41
5.3.9 ClassOne Expands Engineering Team 42
5.3.10 Axcelis Announces Successful Evaluation of Purion Dragon Tool 42
5.3.11 Veeco Announces Orders for Laser Annealing Platform 42
5.3.12 Samco Opens New Research Center 42
5.3.13 Edwards Invests in New Facility to Support Semiconductor Growth 43
5.3.14 Analog Devices Expands European Operations 43
5.3.15 5N Plus Appoints President and CEO 43
6. Silicon Devices 44
6.1 Business 44
6.1.1 TSMC Reports Q4 and FY ’21 Financials 44
6.1.2 Intel Reports Q4 and FY ’21 Financials 44
6.1.3 Seiko-Epson Reports Q3 FY ‘22 Financials 44
6.1.4 Qualcomm Reports Q1 FY ’22 Financials 45
6.1.5 Silicon Labs Reports Q4 and FY ’21 Financials 45
6.1.6 Sony Reports Q3 FY ’22 Financials 45
6.1.7 Infineon Reports Q1 FY ’22 Financials 45
6.1.8 Microchip Reports Q3 FY ’22 Financials 46
6.1.9 SEI Reports Q3 FY ’21 Financials 46
6.1.10 On Semiconductor Reports Q4 and FY ’21 Financials 46
6.1.11 ChipMOS Reports Record January 2022 Revenue 46
6.1.12 Galaxy Semiconductor to Acquire Ippon Innovation 47
6.1.13 SMIC Reports Q4 and FY ’21 Financials 47
6.1.14 Intel to Acquire Tower Semiconductor 47
6.1.15 Tower Reports Q4 and FY ’21 Financials 48
6.1.16 Broadcom Reports Q1 FY ’22 Financials 48
6.1.17 Semtech Reports Q4 and FY ’22 Financials 48
6.2 New Products 48
6.2.1 pSemi Introduces 5G mmWave RF Front-End Solution 48
6.2.2 pSemi Expands RF SOI Switch Portfolio 49
6.2.3 Graphcore Launches 3D Wafer-on-Wafer Processor 49
6.2.4 Vidatronic Announces 5nm FinFET Power Management IP Series 49
6.3 Other 50
6.3.1 Magnachip Semiconductor Names Chief Financial Officer 50
6.3.2 NXP Ramps Automotive Radar Chip Products 50
6.3.3 TI Expands Radar Sensor Portfolio 50
6.3.4 Siemens Collaborates with UMC 51
6.3.5 Synopsys Joins New Intel Foundry Services Ecosystem Alliance 51
6.3.6 Intel and Alphawave Announce Partnership for Intel Foundry Services 51
6.3.7 Silicon Wafer Shipments and Revenue Set Records in 2021 51
6.3.8 Intel Launches Fund to Build Foundry Innovation Ecosystem 52
6.3.9 Infineon Expands Commitment to Quantum Computing 52
6.3.10 Magnachip Enters Full-Scale Mass Production of OLED DDIC 53
6.3.11 imec, KU Leuven and PragmatIC demonstrate 8-bit microprocessor 53
6.3.12 Bosch to Add Chip Production in Reutlingen 53
6.3.13 Key Foundry Begins Mass Production of Power Semiconductors 53
6.3.14 Sivers Semiconductors and KREEMO Announce 5G module 54
6.3.15 Diodes Inc. to Acquire onsemi Facility and Operations 54
6.3.16 onsemi Divests Wafer Manufacturing Sites as Part of New Strategy 54
6.3.17 Renesas Automotive Semiconductors Selected by Honda 54
6.3.18 pSemi Announces New CEO 55
7. Optoelectronics: Datacoms & Other 56
7.1 Business 56
7.1.1 Lumentum Announces Fiscal Second Quarter 2022 Financial Results 56
7.1.2 Exaktera Acquires ProPhotonix 56
7.1.3 POET to Supply Celestial AI 56
7.1.4 CrayoNano and SemiLEDs to Co-Develop Nanowire UV-C LED Chips 56
7.1.5 II-VI Reports Second Quarter 2022 Results 57
7.1.6 POET Technologies Advances Toward Nasdaq Listing 57
7.1.7 NeoPhotonics Reports Financial Results 57
7.1.8 GlobalFoundries Announces Silicon Photonics Solutions 58
7.1.9 POET Approved for Listing on Nasdaq Capital Market 58
7.2 Datacom 58
7.2.1 Freedom Photonics Claims Laser Amplifier Record 58
7.2.2 II-VI Ships Transceivers to Windstream 59
7.2.3 II-VI Unveils Pluggable Optical Line Subsystem in QSFP Form Factor 59
7.2.4 Trumpf Reveals Datacom VCSEL Roadmap 59
7.2.5 Marvell Announces 400G Silicon Photonics Platform 59
7.2.6 POET Technologies Launches Receive Optical Engines 60
7.2.7 Lumentum Increases Share Repurchase Authorization 60
7.2.8 NeoPhotonics Demonstrates InP-based Components 60
7.2.9 Credo Expands Optical DSP Family 60
7.2.10 NeoPhotonics Announces Ultra-Narrow Linewidth Laser 61
7.2.11 Ranovus Announces Odin™ Optical I/O Cores 61
7.2.12 Ranovus and TE Connectivity Collaborate on CPO Platform 61
7.2.13 Source Photonics Demos 50G PAM4 SFP56 Transceivers 61
7.2.14 MACOM Introduces 128 GBaud Products for Coherent Applications 62
7.3 Other 62
7.3.1 UK University Leads Collaboration on Micro-Displays and VLC 62
7.3.2 Hesai and Lumentum Partner on Next-Generation LiDAR Solutions 62
7.3.3 Princeton Infrared Extended SWIR Camera for Beam Profiling 63
7.3.4 EPISTAR Develops Record-output SWIR LEDs 63
7.3.5 Lextar Supplies AEC-Q102-qualified VCSELs to Automakers 63
7.3.6 TRUMPF Presents Controlled Polarized VCSEL 63
7.3.7 Ushio Ships 1.2 W Red Multi-Mode Laser Diodes 63
7.3.8 ams OSRAM Partners with Luxonis on Robotic 3D Vision System 64
8. Analyst Contacts 65
 
 


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