Author: Eric Higham


Publication Date: 8月 03 2018


Pages: 57


Report Type: Report, Word



 高级半导体

Compound Semiconductor Industry Review: April - June 2018




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Report Summary:

Sequential revenue reports this quarter across this entire segment were generally positive. Were there were issues, most companies pointed to developments in China as the cause. Several process announcements indicated supply chain improvements to support 5nm silicon nodes, power GaN wafers and GaAs integration

Table of Contents

1.      Executive Summary

2.      Introduction

3.      MMICs

3.1     Business

3.1.1       Richardson Electronics Reports Third Quarter Results

3.1.2       TTM Technologies Completes Acquisition of Anaren

3.1.3       MACOM Announce Q2 FY ’18 Results

3.1.4       II-VI Reports Q3 FY ’18 Financials

3.1.5       Qorvo Reports Q4 and FY ’18 Financials

3.1.6       Infineon Reports Q2 FY ’18 Financials

3.1.7       Skyworks Reports Q2 FY ’18 Financials

3.2     New Products

3.2.1       Akoustis Expands Filter Portfolio with 3.8 GHz BAW Filter

3.2.2       Custom MMIC Expands Switch Portfolio

3.2.3       Mini-Circuits Expands Product Line Coverage Up To 65 GHz

3.2.4       Empower Announces RF SSPA

3.2.5       Custom MMIC Introduces New Mixer Range

3.2.6       WIN Expands GaN Power Process Capabilities

3.2.7       Cobham Launches New X-Band Limiter

3.2.8       MACOM Launches GaAs-based PAs for SatCom and VSAT

3.2.9       Richardson RFPD Announces RF Transceiver from Analog Devices

3.2.10     WIN Semiconductors Releases New Technology Platform

3.2.11     Qorvo Announces X-Band GaN FEMs

3.2.12     MACOM Develops Portfolio of Wideband Double-Balanced Mixers

3.2.13     Comtech PST Offers GaN Power Amplifier

3.2.14     Guerrilla RF Announces New RF Mixer

3.2.15     Akoustis Introduces 5.2 GHz BAW RF Co-Existence Filter

3.2.16     Skyworks Launches Latest 2.4 GHz WLAN Front-End Module

3.3     Other

3.3.1       Remtec Introduces Thick Film Gold Process on Ceramic

3.3.2       AR RF/Microwave Instrumentation Earns ISO 9001:2015 Certification

3.3.3       Advantech Receives BUC Follow up Order

3.3.4       Integra Introduces New Millimeter Wave Manufacturing Solution

3.3.5       University of Oklahoma Develops Next-Generation Radar Technology

3.3.6       Skyworks Solutions Awarded 3-D Stacking Patent

3.3.7       Raytheon AESA Radar Passes 3,000 Hours of Operations

3.3.8       Integra to Launch Several RF Power Devices

3.3.9       Anokiwave Expands Design Center

3.3.10     Qorvo Appoints Corporate VP Global Operations

4.      Power Devices

4.1     Business

4.1.1       Cree Licenses GaN Power Patents to Nexperia

4.1.2       Microchip Technology Announces Completion of Microsemi Acquisition

4.1.3       ON Semiconductor Expands Manufacturing Operations

4.2     New Products

4.2.1       Integra Technologies Expands Power Transistor Portfolio

4.2.2       EPC Launches 350V eGaN Power Transistor

4.2.3       Advantech Launches 600W C-band GaN-based SSPA/BUC

4.2.4       Microsemi Introduces Scalable PFC Technology

4.2.5       Microsemi Expands SiC Product Portfolios

4.2.6       Microsemi Announces SiC MOSFET Package

4.2.7       GaN Systems Introduces Power Amplifiers for Wireless Charging

4.2.8       ON Semiconductor Introduces Family of Buck Regulators

4.2.9       Littelfuse Adds GEN2 1200V SiC Schottky Diodes

4.2.10     Wolfspeed Expanded Power Portfolio

4.2.11     NXP Showcases GaN and Si-LDMOS Products for 5G

4.3     Other

4.3.1       Gripen E has New AESA Radar and Multi-Functional EW System

4.3.2       EPC Completes Automotive AEC Q101 Qualification for Two eGaN Devices

4.3.3       3-5 Power Electronics Starts GaAs Power Semiconductor Production

4.3.4       EpiGaN Showcases RF Power and Power Switching GaN Technology

4.3.5       ROHM and GaN Systems Collaborate on Gallium Nitride Power Semiconductors

4.3.6       Infineon to Start Volume Production of CoolGaN 400V and 600V e-Mode HEMTs

4.3.7       VisIC Expands GaN Power Device Portfolio

5.      Materials & Equipment

5.1     Business

5.1.1       Lam Research Reports Results for the Quarter Ended March 25, 2018

5.1.2       Soitec Reports FY'18 Fourth Quarter Results

5.1.3       AXT Announces First Quarter 2018 Financial Results

5.1.4       BE Semiconductor Industries Reports Fiscal 2018 First Quarter Results

5.1.5       AIXTRON Reports First Quarter 2018 Results

5.1.6       Riber Reports First Quarter 2018 Results

5.1.7       Paragraf Closes £2.9 Million Seed Round

5.1.8       Axcelis Reports Results for First Quarter 2018

5.1.9       Camtek Reports First Quarter 2018 Results

5.1.10     GSI Technology Reports Fourth-Quarter and Fiscal 2018 Results

5.1.11     Veeco Instruments Reports First Quarter 2018 Results

5.1.12     Applied Materials Reports Second Quarter 2018 Results

5.1.13     Photronics Reports Second Quarter 2018 Results

5.1.14     IQE AGM Statement on VCSELs and Management

5.1.15     Plasma-Therm Completes Corial Acquisition

5.2     Contracts

5.2.1       ON Semiconductor Chooses Veeco Propel HVM MOCVD System

5.2.2       VPEC Expands Capacities with Multiple AIXTRON MOCVD Cluster Systems

5.2.3       EV Group Receives Order from VTT Technical Research Centre

5.2.4       Axcelis Announces Multiple Implanter Orders

5.2.5       VPEC Selects LayTec for VCSEL Manufacturing

5.2.6       Silvaco’s Device Simulator Selected for GaO™ Development

5.2.7       Riber Announces Order for Research MBE System from IIT Bombay

5.3     Other

5.3.1       SEMI Reports 2017 Global Semiconductor Equipment Sales

5.3.2       SEMI Reports Record Semiconductor Photomask Sales

5.3.3       Allos Wins CS Material and Substrates Award

5.3.4       Global Semiconductor Sales Up 20% Year-to-Year in Q1

5.3.5       Orbotech and IME to Develop Advanced Packaging Solutions

5.3.6       VCSEL Makers Choose ClassOne Plating Systems

5.3.7       AMO Using Oxford Instruments Solutions Graphene Photonics Devices

5.3.8       Cardiff University Opens Refurbished Cleanroom

5.3.9       Manchester 2D Materials Centre Announces First Partners

5.3.10     GTAT Opens Silicon Carbide Manufacturing Facility

6.      Silicon Devices

6.1     Business

6.1.1       TSMC Reports Q1 FY 2018 Financials

6.1.2       Qualcomm Reports Q2 FY ‘18 Financials

6.1.3       UMC Reports Q1 FY ’18 Financials

6.1.4       Maxim Reports Q3 FY ’18 Financials

6.1.5       Cypress Reports Q1 FY 2018 Financials

6.1.6       NXP Reports Q1 FY ’18 Financials

6.1.7       Maxlinear Reports Q1 FY ’18 Financials

6.1.8       TowerJazz Reports Q1 FY 2018 Financials

6.1.9       Microchip Reports Q4 and FY ’18 Financials

6.1.10     Adesto Announces Acquisition of S3 Semiconductors

6.1.11     SEI Reports Q4 and FY ’17 Financials

6.1.12     Analog Devices Reports Q2 FY ’18 Financials

6.1.13     Renesas Electronics Closes and Consolidates Factories

6.1.14     UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor

6.2     New Products

6.2.1       Ampleon Launches ISM Signal Generator IC

6.2.2       Ampleon Announces Matched Input/Output LDMOS Amplifier Module

6.2.3       Anokiwave Introduces New Family of Single Channel Silicon ICs

6.2.4       TowerJazz Releases 300mm 65nm BCD Power Management Platform

6.2.5       Vayyar Imaging Unveils the CMOS SOC for mmWave 3D Imaging

6.2.6       TowerJazz and Newsight Announce CMOS Image Sensor Chips

6.2.7       ON Semiconductor Corp Acquires SensL Technologies

6.2.8       Anokiwave Expands 5G Millimeter Wave Family

6.2.9       Ampleon Announces First Gen9HV LDMOS RF PA Transistor

6.2.10     Analog Devices Expands RadioVerse Family

6.2.11     pSemi Introduces Family of Switch + LNA Modules

6.2.12     pSemi Expands Digital Step Attenuator (DSA) Portfolio

6.2.13     pSemi Showcases 5G mmWave Portfolio at IMS 2018

6.3     Other

6.3.1       TSMC Certifies Synopsys Design Platform for 7nm FinFET Plus Technology

6.3.2       Mentor Enhances Tool Portfolio for TSMC Processes

6.3.3       Synopsys Design Platform Certified for Samsung 8LPP Process Technology

6.3.4       Imec Demonstrates 140 GHz CMOS Radar with On-Chip Antennas

6.3.5       SemiGen Announces New Foundry Capabilities

6.3.6       Imec Presents in High-Mobility Nanowire FETs

6.3.7       TowerJazz Announces RF SOI 65nm Ramp in its 300mm Fab

7.      Optoelectronic Devices

7.1     Business

7.1.1       EMCORE Announces Preliminary Financial Results for the Second Fiscal Quarter

7.1.2       nLIGHT Announces Pricing of Initial Public Offering

7.1.3       Fujitsu Reports Q4 and FY ‘17 Financials

7.1.4       Sony Reports Q4 and FY ’18 Financials

7.1.5       POET Technologies Reports Full Year 2017 Financial Results

7.1.6       Coherent Reports Second Fiscal Quarter Results

7.1.7       Lumentum Reports Third Quarter 2018 Results

7.1.8       Oclaro Announces Third Quarter 2018 Results

7.1.9       NeoPhotonics Reports First Quarter 2018 Results

7.1.10     Finisar Reports Full Year and Fourth Quarter Results

7.2     Datacom

7.2.1       Kaiam and Broadex Partner to Produce Optical Transceivers in China

7.2.2       Emcore Releases CATV Transmitter

7.2.3       Sofradir and ULIS Reorganizing to Improve Efficiency

7.2.4       Kaiam Offers Enhanced 100G Transceivers

7.2.5       Almae to Co-develop Laser Modules with POET

7.2.6       Finisar Demonstrates VCSEL and Diffractive Optics Technology

7.2.7       Acacia Announces Coherent CFP and CFP2 DCO Pluggable Modules

7.2.8       EU Project to Combine InP Quantum Dots and SiN

7.3     Other

7.3.1       CST Global joins European Photonics Industry Consortium

7.3.2       Marktech Expands Photodetector Design and Manufacturing Capabilities

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