Gallium_Arsenide高级半导体

高级半导体

Compound Semiconductor Industry Review April - June 2015: Microelectronics



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Report Summary:

Financial results in the microelectronics sector of compound semiconductor segment were mixed, but this is not cause for concern since the previous quarter saw spectacular revenue growth. Revenue is still growing nicely on a yearly basis. GaN product development occupied center stage, with several companies developing products for RF and power electronics applications.


Table of Contents

1. Executive Summary 3

2. Introduction 5

3. MMICs 11

3.1 Company Results 11

3.1.1 Microsemi Reports Q2 FY ’15 Financials 11
3.1.2 WIN Semiconductors Reports Q1 FY ’15 Financials 11
3.1.3 MACOM Reports Q2 FY ‘15 Financials 11
3.1.4 Fujitsu Reports Q4 and FY ’14 Financials 12
3.1.5 Skyworks Reports Q2 FY ‘15 Financials 12
3.1.6 Sony Reports Q4 and FY ’15 Financial Results 12
3.1.7 ANADIGICS Reports Q1 FY ’15 Results 13
3.1.8 Qorvo Reports Q4 & FY 2015 Results 13
3.1.9 MACOM Reports Revised GAAP Loss per Share for Second Quarter 13
3.1.10 SEI Reports Q4 and FY ’14 Results 13
3.1.11 Avago Reports Q2 FY ’15 Financials 14
3.1.12 GigOptix Increases Second Quarter and Fiscal 2015 Revenue Guidance 14

3.2 Contracts 14

3.2.1 ANADIGICS Ships Wi-Fi Infrastructure Power Amplifier 14
3.2.2 Global Technology Selects ANADIGICS Infrastructure Line Amplifier 14

3.3 New Products 15
3.3.1 ANADIGICS Expands Small Cell Wireless Infrastructure Power Amplifier Family 15
3.3.2 Custom MMIC Launches 10-14 GHz LNA 15
3.3.3 Mouser Electronics Offers Avago Amplifier Modules for 2.4 GHz 15
3.3.4 MACOM Introduces DC-50 GHz Wideband Amplifier 15
3.3.5 Cree Develops 30W Ku-band GaN-on-SiC MMIC Amplifier 16
3.3.6 Freescale Expands Airfast RF Power Portfolio 16
3.3.7 MACOM Develops 6W Ka-Band Power Amplifier 16
3.3.8 Cobham Develops Customisable Dual-Polar C-Band Antennas 16
3.3.9 Fairview Launches Family of X-Band Amplifiers 17
3.3.10 Richardson RFPD Announces Availability of Qorvo GaN Transistor 17
3.3.11 United Monolithic Semiconductors Launch 0.5-20 GHz Driver Amplifier 17
3.3.12 Diamond Microwave Adds X-band SSPA 17
3.3.13 Custom MMIC Introduces GaN & GaAs MMICs 18
3.3.14 Freescale Introduces GaN RF Power Transistor for Cellular Base Stations 18
3.3.15 Freescale Develops RF Power GaN Transistors in Plastic Packages 18
3.3.16 Qorvo Announces Power Amplifiers for Small Cell Base Station Applications 18
3.3.17 Qorvo Introduces 802.11ac Power Amplifiers 19
3.3.18 Skyworks Expands Switch Family for the Internet of Things 19
3.3.19 API Technologies Debuts Two Power Amplifier Solutions 19
3.3.20 MACOM Expands GaN Portfolio with Power Amplifier 20
3.3.21 Qorvo Announces Hybrid GaN/GaAs Point-to-Point Power Amplifier Family 20
3.3.22 Qorvo Introduces High Power Plastic Packaged GaN MMICs 20
3.3.23 Qorvo Expands Plastic GaN Transistor Family 21
3.3.24 Skyworks Unveils Front End Modules for Smart Energy and ISM Markets 21
3.3.25 Skyworks Introduces High Frequency Ceramic Filters 21
3.3.26 MACOM Introduces GaN-on-Si Transistor 21
3.3.27 Avago Develops SDARS LNA-Filter Module 22
3.3.28 Richardson RFPD Introduces Qorvo GaN RF Transistor 22
3.3.29 Mini-Circuits Launches Wideband 8-Way 0° Splitter/Combiner 22
3.3.30 Pasternack Releases Family of SSPAs 22
3.3.31 Richardson RFPD Announces GaN-on-SiC HEMTs from UMS 23
3.3.32 Richardson RFPD Announces DC-3.5 GHz GaN Transistors from Qorvo 23
3.3.33 Richardson RFPD Introduces 2G CDMA Modem for M2M Applications 23
3.3.34 UMS Launches K-band Power Amplifier 23
3.3.35 UMS Offers X-band GaN HPA 24
3.3.36 Richardson RFPD Announces Availability of OCXOs from IQD 24
3.3.37 Richardson RFPD Introduces Digital Step Attenuators from Peregrine 24
3.3.38 Richardson RFPD Introduces 1W GaAs Ku-band Power Amplifier from Qorvo 24
3.4 Other 25
3.4.1 Hittite Microwave Awarded Cavity Resonators US Patent 25
3.4.2 Microsemi Announces Expiration of HSR Waiting Period for Vitesse Tender Offer 25
3.4.3 Skyworks Solutions Awarded a Flip Chip Patent 25
3.4.4 Pasternack Appoints QA Manager 25
3.4.5 MACOM Announces Fourth Generation GaN Technology 26
3.4.6 Modelithics Expands Qorvo GaN Transistor Simulation Model Library 26
3.4.7 Guerrilla RF Completes Series B Funding Round 26
3.4.8 WIN Semiconductors Continues Third Fab Expansion 26
3.4.9 WIN Semiconductors Releases Next Generation pHEMT Process 27
3.4.10 Freescale & Lansdale Partner on Amplifiers 27
3.4.11 IDT & EPC Collaborate To Integrate GaN and Silicon into Devices 27
3.4.12 Qorvo Announces Second Edition of "GaN for Dummies" Book 27
3.4.13 GigOptix Renews Interest in Acquiring GSI Technology 28
3.4.14 API Technologies Appoints VP Worldwide Sales 28
3.4.15 Skyworks Opens Design Center 28
3.4.16 NI Announces AWR Design Environment V12 28
3.4.17 GaN Transmitter Completes Second Year aboard ESA Proba-V Satellite 29

4. POWER DEVICES 31

4.1 New Products 31

4.1.1 MACOM GaN Bias Controller & Sequence Module 31
4.1.2 EPC Introduces Wide-pitch eGaN FETs 31
4.1.3 EPC Develops 100V Monolithic GaN Power Transistor Half-Bridge 31
4.1.4 Richardson RFPD Announces SiC MOSFET-based Power Modules from Vincotech 32
4.1.5 EPC Expands eGaN Power Transistor Family 32
4.1.6 Fuji Electric Launches SiC Hybrid Power Module 32
4.1.7 VisIC Launches 650V Normally-off GaN Power Switches 32
4.1.8 GeneSiC Announces SiC Junction Transistors Diodes in Mini-Module 33
4.1.9 Panasonic Develops Normally-off 600V GaN Power Transistors 33
4.1.10 GaN Systems Expands E-mode GaN Power Transistor Family 33
4.1.11 Infineon Develops High-Power, Light-Triggered Thyristor 33
4.1.12 ON Semiconductor Introduces Power Integrated Module 34
4.1.13 Infineon Produces Power MOSFETs on 300-Millimeter Thin-Wafer Technology 34
4.1.14 Vishay Intertechnology Introduces Fast Body Diode N-Channel MOSFET 35
4.1.15 GaN Systems Claims Smallest 650V, 15A GaN Transistor 35
4.1.16 EPC Expands eGaN FET Power Transistor Family 35
4.1.17 Toshiba Introduces SiC-based UPS Modules 35
4.1.18 CISSOID Releases High Temperature Power Module 36
4.1.19 Advantech Wireless Releases 150W Ku-band GaN-based BUC SSPA/SSPB 36
4.1.20 Richardson RFPD Introduces Two 900V SiC MOSFETs from Cree 36
4.1.21 ROHM Introduces 600V SOI Intelligent Power Module Family 36
4.1.22 Mitsubishi Electric Announces SiC Power Modules for Railcar Traction Inverter 37
4.1.23 VisIC Technologies Launches 650V ALL-Switch GaN Product Family 37

4.2 Other 374.2.1 HiPoSwitch Project Completes with Normally-off GaN-on-Si Power Transistors 37
4.2.2 Digi-Key to distribute Global Power Technologies' SiC products worldwide 37
4.2.3 Anvil Developing SiC Technology to Modernize Grid 38
4.2.4 Translucent and Vilnius Link up for Non-Polar GaN 38
4.2.5 GaN Systems Raises Series C Financing 38
4.2.6 Northrop Grumman Triple Presence at US Nitride Meetings 38
4.2.7 Cree Registers for IPO of Power & RF Subsidiary 39
4.2.8 Northrop Grumman Reports Highest-Power Single-Chip Ka-Band Power Amplifier 39
4.2.9 Kopin Divests Interest in Recon Instruments 39
4.2.10 German Luftstrom Project to Investigate Battery Technology for Electric Vehicles 39

5. Silicon Devices 41

5.1 Company Results 41
5.1.1 TSMC Reports Q1FY ’15 Financials 41
5.1.2 Fairchild Reports Results for the First Quarter 2015 41
5.1.3 Freescale Reports Q1 FY ‘15 Financials 41
5.1.4 Maxim Reports Q3 FY ’15 Financials 41
5.1.5 imec reports 9% growth in 2014 41
5.1.6 Infineon Reports Q2 FY ’15 Financials 42
5.1.7 Atmel Reports Q1 FY ’15 Financials 42
5.1.8 Renesas Reports Q4 and FY 2015 Results 42
5.1.9 TowerJazz Reports Q1 FY ’15 Results 42
5.1.10 Analog Devices Reports Q2 FY ’15 Results 43

5.2 New Products 43
5.2.1 Crystek Introduces 3000 MHz VCO 43
5.2.2 Peregrine Semiconductor Expands Automotive Product Portfolio 43
5.2.3 Mitsubishi Electric Develops Prototype Active Phased Array Antenna for 5G 43
5.2.4 Microsemi Announces Radiation-tolerant FPGAs 44
5.2.5 Peregrine Semiconductor Introduces First UltraCMOS MPAC Product 44
5.2.6 Richardson RFPD Introduces 10 MHz - 40 GHz Switch from Peregrine 44
5.2.7 Qorvo Announces SOI Components for Broadband Communications Systems 44
5.2.8 Analog Devices Introduces a 4-channel, 24 GHz Receiver Downconverter 45
5.2.9 Rohm Starts Mass Production of Trench-Type SiC MOSFET 45
5.2.10 TI Introduces Low Power Wideband RF Synthesizer 45
5.2.11 Amplical Launches Family of Coaxial PIN Diode Switches 46

5.3 Other 46

5.3.1 MagnaChip Announces Notice of Noncompliance with NYSE Standards 46
5.3.2 Global Semiconductor Sales Increase in February 46
5.3.3 MagnaChip Semiconductor COO Resigns 47
5.3.4 NXP Semiconductors Announces Agreement to Sell RF Power Business 47
5.3.5 Microchip Technology to Acquire Micrel 47
5.3.6 TowerJazz & UCSD Develop 60 GHz Wafer-Scale Phased Array Transmitter 47
5.3.7 Peregrine Semiconductor Names VP of Business Development 48
5.3.8 Peregrine Semiconductor Appoints VP of Worldwide Sales 48
5.3.9 Samtec Joins Silicon Photonics Program of the IRT Consortium 49
5.3.10 SiBEAM Announces Single-chip CMOS Transmitter Design Win 49
5.3.11 MagnaChip to Offer 0.18 micron 100V High Voltage BCD Process 49
5.3.12 Soitec & SITRI to Collaborate on RF-SOI Technology 50
5.3.13 imec Presents Post-FinFET Research at VLSI Symposium 50
5.3.14 GLOBALFOUNDRIES Receives Approval for IBM Microelectronics Acquisition 50


 

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