Powertrain_Body_Chasis&Safety 动力总成、车身、底盘及安全

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Author: Asif Anwar
Publication Date: 4月 23 2020
Pages: 9
 Report Type: Insight, Word

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动力总成、车身、底盘及安全

Can TI "Drive" GaN Power Electronics in the Automotive Market?



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Report Summary:

COVID-19 notwithstanding, as HEV/EV vehicles become a greater proportion of the global vehicle manufacturing mix, SiC is widely touted as the technology that will replace Si-based power electronics for use in xEV inverters, converters and on-board chargers. Can TI bring its industry expertise and manufacturing prowess to bear on GaN as a viable alternative to both Si- and SiC-based power electronics?

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