Gallium_ArsenideAdvanced Semiconductors

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Author: Eric Higham
Publication Date: May 20 2016
Pages: 28
 Report Type: Forecast and Outlook

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Advanced Semiconductors

RF GaN Market Update: 2015 - 2020



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Report Summary:

GaN continues to see strong adoption in RF applications. Driven by wireless infrastructure and growth in defense applications, Strategy Analytics forecasts GaN RF revenue will more than double to reach nearly $690 million in 2020. The industry will migrate to larger wafer diameters, but the vast majority of the revenue will continue to be produced on GaN-on-SiC wafers.
Table of Contents

3.1     Overview   6

3.2     GaN RF Device Market 2015-2020  6

3.2.1       Commercial and Defense Market Overview  7

3.2.1       Commercial RF GaN Application Trends  9

3.2.2       Defense RF GaN Application Trends  13

3.3     RF GaN Substrate Trends  15

4.1     Solid State Power Device Topologies  18

4.1.1       HEMT  18

4.1.2       LDMOS  19

4.1.3       Bipolar Junction Transistor (BJT) 19

4.1.4       Heterojunction Bipolar Transistor (HBT) 21

4.2     RF Power Technology Landscape  21

4.2.1       Solid-State Technologies  21

4.3     Price Evolution  23

Exhibits

Exhibit 3‑1                RF GaN Device Revenue Forecast: 2015-2020. 7

Exhibit 3‑2                RF GaN Device Revenue Forecast: 2015-2020. 8

Exhibit 3‑3                RF GaN Market Share Forecast: 2015-2020. 9

Exhibit 3‑3                Commercial RF GaN Revenue Forecast: 2015-2020. 10

Exhibit 3‑5                Defense RF GaN Revenue Forecast: 2015-2020. 14

Exhibit 3‑6                Defense RF GaN Revenue Forecast: 2015-2020. 16

Exhibit 3‑7                Defense RF GaN Revenue Forecast: 2015-2020. 17

Exhibit 4‑1                Generic GaN HEMT Structure. 18

Exhibit 4‑2                Representative LDMOS Structure. 19

Exhibit 4‑3                Transistor Energy State Diagram.. 20

Exhibit 4‑4                Transistor Energy State Diagram.. 21

Exhibit 4‑5                Competitive Solid-State RF Power Technologies. 22

Exhibit 4‑6                Material Properties. 23

Exhibit 4‑7                Plastic Packaged GaN Power Amplifiers for Base Station Applications. 24

Exhibit 4‑8                Efficiency of GaN in Plastic Packages. 25

Exhibit 4‑8                Packaging Thermal Resistance. 26

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