Gallium_ArsenideAdvanced Semiconductors

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Author: Eric Higham
Publication Date: Feb 02 2021
Pages: 40
 Report Type: Report, Word

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Advanced Semiconductors

Compound Semiconductor Industry Review: October - December 2020



Report Summary:

Financial results in this report indicate that the electronics industry has weathered the storm brought about by COVID. There may still be some choppy water, but companies in all segments of the electronics industry are seeing strong revenue growth. Working from home appears to have slowed the product development/announcement process, but there were still some interesting announcements. 
Table of Contents

Contents
1. Executive Summary 7
2. Introduction 8
3. MMICs 9
3.1 Business 9
3.1.1 Qorvo Acquires UWB Software Provider 7Hugs Labs 9
3.1.2 Skyworks Reports Q4 and FY ’20 Financials 9
3.1.3 Qorvo Reports Q2 FY ’21 Financials 9
3.1.4 Qualcomm Reports Q4 and FY ’20 Financials 9
3.1.5 MACOM Reports Q4 and FY ‘20 Financials 10
3.1.6 Microchip Reports Q2 FY ’21 Financials 10
3.1.7 Analog Devices Reports Q4 and FY ’20 Financials 10
3.2 New Product 10
3.2.1 Skyworks Launches High-Linearity Sky5 Switch 10
3.2.2 RFHIC RF Launches 100W, CW, GaN Solid-State Microwave Generator (SSMG) 10
3.2.3 Skyworks Launches Surface Mount Circulator 11
3.2.4 Guerrilla RF Launches InGaP HBT Power Amplifier 11
3.2.5 RFMW Supports Qorvo 20W Transistor for 5G mMIMO Infrastructure 11
3.2.6 Ampleon Launches RF Power Transistors and Doherty Amplifiers 11
3.2.7 RFMW Supports Qorvo 4W PAs for Small Cell Applications 12
3.2.8 RFMW Supports CML Microcircuits’ Multi-Mode Wireless Data Modem IC 12
3.2.9 Micro Crystal Launches Temperature Compensated RTC Module 12
3.2.10 Qorvo Expands Cellular IoT Portfolio 12
3.2.11 RFHIC Launches 5W, GaN Hybrid Wideband Power Amplifier 13
3.2.12 Menlo Micro Introduces “Ideal Switch” Technology 13
3.2.13 Triad RF Systems Develops Bi-directional SSPA 13
3.2.14 Qorvo Introduces Low Noise Amplifier for Defense Receivers 13
3.2.15 AT Microwave Introduces Family of Voltage Controlled Attenuators 13
3.2.16 Qorvo Launches Programmable Power Management ICs 14
3.2.17 Qorvo Unveils Family of Front End Transmit/Receive Modules Delivering 14
3.2.18 Skyworks Launches High-Power 5GHz Front-End Module 14
3.2.19 Qorvo Introduces 100W GaN Power Amplifier for C-Band Applications 14
3.2.20 Otava Develops 24-40 GHz 8 Channel Beamformer IC 15
3.3 Other 15
3.3.1 Quik-Pak, Agile Microwave and OMMIC Announce Packaging Solutions 15
3.3.2 Northrop Grumman’s Digital Antenna Passes Key Milestone 15
3.3.3 Qorvo Selected to Create RF Semiconductor Packaging Center 15
3.3.4 Filtronic Celebrates 10 Years of Manufacturing E-band RF Transceivers 16
3.3.5 Marki Microwave Names Vice President of Sales and Marketing 16
3.3.6 Filtronic Joins the HAPS Alliance 16
3.3.7 Akoustis Reports XBAW Coexistence Filter Design Win 16
3.3.8 Altum RF to Develop GaN Ka-Band High Power Amplifiers 16
3.3.9 Comtech Receives Order for Medical Applications 16
4. POWER DEVICES 17
4.1 Business 17
4.1.1 VisIC Technologies Raises Series E to Support EV market 17
4.1.2 Infineon Reports Q4 and FY ’20 Financials 17
4.1.3 Transphorm Expands Multi-year Development Agreement with Yaskawa 17
4.1.4 Transphorm Closes Private Placement 17
4.2 New Products 17
4.2.1 Navitas & Hyper Reveal Stackable Mobile Fast Chargers 17
4.2.2 EPC Space Launches Rad-hard eGaN Drivers and Power Stages 18
4.2.3 EPC Releases DC–DC Conversion Demo Boards 18
4.2.4 UnitedSiC Introduces New SiC FET Devices 18
4.2.5 Transphorm Announces SuperGaN Gen V FET 18
4.2.6 Infineon Launches 1200V SiC IPM 18
4.2.7 MagnaChip Launches a Family of Super Junction MOSFETs 19
4.2.8 GaN Systems and ON Semiconductor Release Evaluation Board 19
4.2.9 Kaco Unveils String Inverters with SiC Transistors 19
4.2.10 Dell Adopts Navitas GaNFast ICs for Laptop Fast Charger 19
4.2.11 EPC Launches DC-DC Voltage Regulator Power Module 20
4.2.12 EPC Introduces eGaN FET 20
4.2.13 VisIC Develops Power GaN Switch for EV Inverters 20
4.3 Other 20
4.3.1 STMicroelectronics Unveils MasterGaN® 20
4.3.2 StratEdge to Display Packaging and Assembly Service Capabilities 20
4.3.3 Researchers Report on a Vertical Power Trigate SiC MOSFET 21
4.3.4 DENSO Produces SiC Power Semiconductors for Fuel Cell Vehicles 21
4.3.5 GaN Systems Launches IMS3 Platform for Use with GaN E-HEMTs 21
4.3.6 EPC’s eGaN FETs Used in BrightLoop DC-DC Buck Converters 21
4.3.7 Toyoda Gosei GaN Power Devices Chosen for Japan’s CO2 Reduction Project 21
4.3.8 GaN Systems Transistors Used in Philips Charger 22
5. MATERIALS & EQUIPMENT 22
5.1 Business 22
5.1.1 Riber Announces 2020 First-Half Earnings 22
5.1.2 RIBER and Comptek Solutions Announce Commercial Partnership 22
5.1.3 AIXTRON Announces Successful Start to Second Half of 2020 22
5.1.4 AXT Announces Third Quarter 2020 Financial Results 23
5.1.5 IQE Provides Trading Update 23
5.1.6 AXT Completes the Ramp from Dingxing Manufacturing Facility 23
5.1.7 Siltronic and GlobalWafers to Combine Activities 23
5.1.8 UAES and ROHM Open Joint SiC Laboratory 23
5.1.9 Ferrotec Acquires MeiVac 24
5.2 Contracts 24
5.2.1 Axcelis Announces Implanter Orders 24
5.2.2 ClassOne Solstice S4 Wet Processing System Chosen by TRUMPF 24
5.2.3 A-Pro Semicon Chooses Veeco MOCVD Platform 24
5.2.4 Aledia Selects Veeco’s 300mm MOCVD Platform 24
5.2.5 Modulight Opts for AIXTRON System 25
5.2.6 OSRAM Opto Semiconductors Qualifies Veeco Lumina MOCVD System 25
5.2.7 Konka Chooses Samco For MicroLED Production 25
5.2.8 European Research Order for Riber 25
5.2.9 Transphorm Selects Veeco MOCVD Platform for GaN Devices 25
5.2.10 Riber Receives Order for Research MBE System 26
5.2.11 EpiWorld Qualifies Aixtron AIX G5 WW C System 26
5.3 Other 26
5.3.1 Tektronix Introduces Test System to Support Wide Bandgap Fabrication 26
5.3.2 SkyWater Announces MOU for Domestic Packaging 26
5.3.3 SIA Announces Chip Technology Research and Funding Priorities 26
5.3.4 IQE Announces Development of IQGeVCSEL 150™ Technology 27
5.3.5 Umicore Announces Developments in Germanium Wafers for VCSELs 27
5.3.6 SweGaN Introduces New Chairman 27
5.3.7 Compound Photonics Opens MicroLED Innovation Centre 27
5.3.8 AXT Announces Strategic Plan to Access China’s Capital Markets 27
5.3.9 IQE Leadership Announcement 28
5.3.10 Industry Group Drives Graphene Hall Effect Sensors 28
5.3.11 EV Group Unveils Hybrid Die-To-Wafer Bonding Activation Solution 28
5.3.12 LayTec CEO and President to Retire 28
6. Silicon Devices 29
6.1 Business 29
6.1.1 TSMC Reports Q3 FY ‘20 Financials 29
6.1.2 STMicroelectronics Acquires SOMOS Semiconductor 29
6.1.3 NXP Reports Q3 FY ’20 Financials 29
6.1.4 Maxim Reports Q1 FY ’21 Financials 29
6.1.5 Tower Semiconductor Reports Q3 FY ’20 Financials 29
6.2 New Products 30
6.2.1 Ayar Labs Demonstrates Optical Interconnect Solution 30
6.2.2 Renesas Electronics Develops 14-Bit, 1-MSPS Rad Hard ADC 30
6.2.3 Analog Devices Launches Quadband VCOs 30
6.3 Other 30
6.3.1 Global Semiconductor Sales Increase in August 30
6.3.2 ON Semiconductor Appoints New Board Member 31
6.3.3 Global Silicon Wafer Shipments on Track for 2020 Recovery 31
6.3.4 Thales Launches AirMaster C Airborne Surveillance Radar 31
6.3.5 Applied Materials and BE Semiconductor to Accelerate Chip Integration 31
6.3.6 GLOBALFOUNDRIES Receives US DoD Microelectronics Contract Increase 31
6.3.7 On Semiconductor Names New CEO 32
7. Optoelectronics I: Datacoms & Other 32
7.1 Business 32
7.1.1 NeoPhotonics Announces Preliminary Third Quarter Financial Results 32
7.1.2 Aledia Announces Closing of Planned Investment Round 32
7.1.3 Cree Reports Q1 FY ’21 Financials 32
7.1.4 Sony Reports Q2 FY ‘21 Financials 32
7.1.5 SMART Global Holdings to Acquire Cree’s LED Business 33
7.1.6 Applied Optoelectronics Reports Third Quarter 2020 Results 33
7.1.7 SEI Reports Q2 FY ’20 Financials 33
7.1.8 Hitachi Acquires VLC Photonics 33
7.1.9 POET Technologies Reports Third Quarter 2020 Results 34
7.1.10 Synopsys Acquires LIGHT TEC 34
7.1.11 Lumentum Reports First Quarter 2021 Results 34
7.1.12 Diodes Completes Acquisition of Lite-On Semiconductor 34
7.2 Datacom 34
7.2.1 Acacia and NTT Electronics Announce Successful Interoperability Testing 34
7.2.2 Acacia Drives Coherent DWDM Technology 35
7.2.3 Acacia Strengthens Edge and Access Network Portfolio 35
7.2.4 100G Lambda MSA Releases 400G Spec 35
7.2.5 II-VI Converts GaAs Laser Product Line to 6-inch GaAs Platform 35
7.2.6 ROHM Announces VCSEL Module Technology 36
7.2.7 NeoPhotonics Expands Product Portfolio 36
7.2.8 Inphi Introduces 400G DR4 Silicon Photonics Platform Solution 36
7.2.9 POET Releases Multi-Product Mask Set To Production 36
7.2.10 AGC Develops Glass Package for Edge-emitting Laser Diodes 37
7.2.11 Vector Photonics Unveils 1310nm/25G Chip 37
7.2.12 Source Photonics Launches 100G ZR4 QSFP28 transceiver 37
7.2.13 Lumentum Makes First 100G PAM4 DMLs Available for Sampling 37
7.2.14 JePPIX Opens Pilot Line Services for InP PIC Production 37
7.3 Other 38
7.3.1 Si-Ware Systems Introduces Mid-Infrared Spectral Sensing Platform 38
7.3.2 BluGlass Demos Laser Designs 38
7.3.3 AIXTRON Participates in the European Pilot Line for Graphene and 2D Materials 38
8. Analyst Contacts 39

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