Author: Eric Higham


Publication Date: Feb 22 2018


Pages: 55


Report Type: Report, Word



 Advanced Semiconductors

Compound Semiconductor Industry Review: October - December 2017




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Report Summary:

Financial results this quarter were overwhelmingly positive for companies in these semiconductor industry segments. The only negative was some choppiness in the optical segment, but companies report that the worst is past. There is a lot of 5G product development in support of imminent
network deployments. GaN continues to see significant activity in both the RF and power electronics market.


Table of Contents

1.      Executive Summary

2.      Introduction

3.      MMICs

3.1     Business

3.1.1       Qorvo Reports Q2 FY ‘18 Financials

3.1.2       Skyworks Reports Q4 and FY ’17 Financials

3.1.3       Microsemi Reports Q4 and FY ’17 Financials

3.1.4       MACOM Reports Q4 and FY 2017 Financials

3.1.5       Infineon Reports Q4 and FY ’17 Financials

3.2     Contracts

3.2.1       Akoustis Technologies Announces Single Crystal BAW Filter Shipments

3.2.2       Qorvo and HUMAX Provide Zigbee-based Smart Voice Assistant System

3.3     New Products

3.3.1       Richardson RFPD Introduces DC–15 GHz Darlington Amplifier from MACOM

3.3.2       Mitsubishi Electric Develops Ka-band GaN-HEMT MMIC

3.3.3       Qorvo Expands 802.11ax Portfolio

3.3.4       MACOM Expands GaN-on-silicon Portfolio

3.3.5       Anokiwave Adds 256-element, Reconfigurable 28 GHz Array

3.3.6       Qorvo Debuts Line of Small-signal Products

3.3.7       Skyworks Unveils New SkyOne Wi-Fi Family of Front-End Modules

3.3.8       Custom MMIC Expands Mixer Portfolio

3.3.9       Anokiwave Expands Quad Core IC Family

3.3.10     Custom MMIC Develops High-IP3 I/Q Mixer MMICs

3.3.11     Richardson RFPD Introduces GaN X-Band Power Amplifier from UMS

3.3.12     Richardson RFPD Introduces PA Module from NewEdge Signal Solutions

3.4     Other

3.4.1       Plextek RFI and Filtronic Broadband Develop 26 GHz SMT Module

3.4.2       Skyworks Enables All-in-One Connected Car Solutions by ZTE

3.4.3       StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

3.4.4       Qorvo Supplies LTE NB-IoT modules

3.4.5       MACOM Announces Successful Divestiture of AppliedMicro’s Compute Business

3.4.6       Ainstein Introduces 77 GHz Automotive Safety Radar

3.4.7       Skyworks Front-ends Optimize Battery Life of “Nearable” Tracking Devices

3.4.8       VTT Combines Micromechanical Waveguides and MMICs for Terahertz Devices

3.4.9       Resonant Signs Fourth Foundry Partner Agreement

3.4.10     Lockheed Martin Completes CDR for GaN-based Long Range Discrimination Radar

3.4.11     MACOM Closes Belfast Facility

3.4.12     Qorvo Selected for Qualcomm Cellular-V2X Automotive Reference Design

4.      Power Devices

4.1     Business

4.1.1       Transphorm Secures Investment from Yaskawa Electric

4.1.2       Delta Joins BMW iVentures as Strategic Investor in GaN Systems

4.1.3       Tessera Reaches Global Settlement with Broadcom

4.1.4       Intersil to Start Operations as Renesas Electronics America in January 2018

4.2     New Products

4.2.1       Littelfuse SiC Introduces 1200V SiC MOSFET Series

4.2.2       MACOM Announces 500W GaN-on-Si Power Transistor for L-Band Applications

4.2.3       Peregrine Announces FET Driver for GaN Class-D Audio Applications

4.2.4       GaN Systems Launches GaN Power Transistor Evaluation Board

4.2.5       IXYS Introduces 15A RF MOSFET Driver

4.2.6       Power Integrations Expands Gate Driver Family

4.2.7       EPC Develops 150A Laser Diode eGaN Evaluation Board

4.2.8       GaN Systems and Peregrine Offer Evaluation Board

4.2.9       Nexperia Introduces In-Vehicle Network Protection Diodes

4.2.10     EPC Launches New GaN Power Transistor

4.3     Other

4.3.1       MACOM RF Energy Toolkit is Available for Commercial OEMs

4.3.2       Navitas Announces TSMC and Amkor Manufacturing Partnerships

4.3.3       PowerAmerica Adds Director of Power Device Technology

4.3.4       Fujitsu Technology Bonds Single-crystal Diamond and SiC at Room Temperature

4.3.5       Researchers Show Prototype 1200V Vertical GaN Transistor

4.3.6       EPC to Show GaN-Enabled Wireless Power and High Resolution LiDAR

4.3.7       GaN Systems Honors China Power Supply Society Competition Winners

4.3.8       GaN Systems Releases High-Power Insulated Metal Substrate Evaluation Platform

4.3.9       Allegro MicroSystems Opens New Facility

4.3.10     University Team Identify Resistance Factors SiC Power Semiconductors

5.      Materials & Equipment

5.1     Business

5.1.1       SweGaN Raises $750,000 in New Share Issue

5.1.2       Comptek Raises €450,000 for Kontrox Technology

5.1.3       CFIUS Approves Sale of AIXTRON ALD/CVD Memory Product Line

5.1.4       AXT Announces Third Quarter 2017 Financial Results

5.1.5       AIXTRON Announces Results for First Nine Months and Q3 2017

5.1.6       Axcelis Announces Financial Results for Third Quarter 2017

5.1.7       Veeco Reports Third Quarter 2017 Financial Results

5.1.8       Orbotech Outlines Plan for Revenues

5.1.9       CVD Equipment Acquires Assets of MesoScribe Technologies

5.1.10     IQE Places New Shares

5.1.11     Oxford Instruments Announces Half Year Results for 2017

5.1.12     Veeco Authorizes Share Repurchase Program

5.1.13     NexWafe Closes New Financing Round

5.1.14     IQE Announces 2017 Pre-close Full Year Trading Update

5.1.15     ProPhotonix Achieves ISO9001: 2015

5.1.16     New JEDEC Committee for Wide Bandgap Power Semiconductors

5.1.17     IQE Group Expands IP Portfolio with Purchase of Quasi Photonic Crystal Patents

5.2     Contracts

5.2.1       Elite Advanced Laser Boosts Capacity with AIXTRON AIX G5+ C

5.2.2       Ichor Systems Enters into Agreement to Produce Liquid Delivery Systems

5.2.3       Veeco Ships First GENxcel MBE System

5.2.4       AMEC Celebrates 100th Shipment of MOCVD System

5.2.5       Lasertel Purchases Oxford Instruments ICPCVD for SSLs

5.2.6       HiWafer Chooses SPTS Omega Plasma Etch System

5.2.7       Xiamen Changelight Expands ROY LED Production with MOCVD from AIXTRON

5.2.8       Chinese Lighting Company Selects Veeco New MOCVD System

5.2.9       Tokyo University Chooses EVG System for Compound Semi Research

5.3     Other

5.3.1       GaN Systems and Taiwan MOEA Collaborate on GaN Technology

5.3.2       EpiGaN to Supply OMMIC with GaN/Si Material

5.3.3       INNOViON Expands High Energy Capabilities

5.3.4       Sumitomo Electric Launches EpiEra SiC Epiwafer

5.3.5       LayTec Ships EpiTT VCSEL Systems

5.3.6       Semiconductor Industry Posts Highest-Ever Quarterly Sales

5.3.7       Kyma Demonstrates 200mm GaN HVPE GaN-on-QST Wafers

5.3.8       AKHAN Issued Japan Patent on Fabrication of Diamond Semiconductor Materials

5.3.9       AIXTRON Completes Sale of ALD/CVD Memory Product Line

5.3.10     CST Global Appoints China Field Application Manager

5.3.11     InnovateUK Awards Project to CS MAGIC Consortium

5.3.12     KYOCERA Breaks Ground on New Manufacturing Plant

5.3.13     Quanergy Opens Automated Factory To Mass Produce LiDAR sensors

6.      Silicon Devices

6.1     Business

6.1.1       Maxim Reports Q1 FY ’18 Financials

6.1.2       TSMC Reports Q3 FY ‘17 Financials

6.1.3       NXP Reports Q3 FY ’17 Financials

6.1.4       Silicon Labs Reports Q3 FY ’17 Financials

6.1.5       UMC Reports Q3 FY ’17 Financials

6.1.6       Cypress Reports Q3 FY 2017 Financials

6.1.7       Fujitsu Reports Q2 FY ‘17 Financials

6.1.8       Cadence to Acquire nusemi

6.1.9       Third Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter

6.1.10     TowerJazz Reports Q3 FY ’17 Financials

6.1.11     SMIC Reports 2017 Third Quarter Results

6.1.12     Broadcom Remains Fully Committed to Acquisition of Qualcomm

6.1.13     Global Semiconductor Posts Sales Increase

6.2     New Products

6.2.1       Richardson RFPD Design Support for NXP Semiconductors MRFX1K80H

6.2.2       Anokiwave Introduces 26 GHz Silicon 5G Active Antenna IC

6.2.3       Samsung Starts Production of 2nd Generation 10nm FinFET Process Technology

6.2.4       Intersil Introduces Radiation-hardened Power Supply Sequencers

6.3     Other

6.3.1       Skorpios Acquires Novati Technologies

6.3.2       Fujitsu Semiconductor and ON Semiconductor Increase Strategic Partnership

6.3.3       GlobalFoundries Unveils Roadmap for 5G mmWave Applications

6.3.4       SMIC Expands Senior Management Team

6.3.5       University of Illinois Turns to Tektronix to Outfit Nanofabrication Lab

6.3.6       Microsemi to Acquire High Performance Timing Business of Vectron International

6.3.7       Infineon Supplies 77 GHz Radar ICs for Autonomous Driving Applications

6.3.8       Soitec Announces Substrate for 3D Image Sensing Devices

6.3.9       Lattice Semiconductor Migrating product line to FDSOI

6.3.10     GlobalFoundries Collaborating with Ayar Labs to Put Optical I/O on Silicon ICs

7.      Optoelectronic Devices

7.1     Business

7.1.1       Cree Reports Q1 FY ’18 Financials

7.1.2       PHIX Photonics Assembly Raises First Round Investment

7.1.3       II-VI Reports Q1 FY ’18 Financials

7.1.4       Sony Reports Q2 FY ‘18 Financials

7.1.5       Oclaro Reports First Quarter Fiscal Year 2018 Financial Results

7.1.6       Renesas Reports Q3 FY ‘17 Financials

7.1.7       Coherent Reports Fourth Fiscal Quarter and Year-End Results

7.1.8       SEI Reports Q2 FY ’17 Financials

7.1.9       Lumentum Reports First Quarter 2018 Results

7.1.10     NeoPhotonics Reports Q3 FY ‘17 Financials

7.1.11     POET Reports Q3 FY ‘17 Financials

7.1.12     IPG Photonics Corp Acquires Laser Depth Dynamics

7.1.13     EMCORE Reports Financial Results for Fourth Quarter and Fiscal Year

7.2     Datacom

7.2.1       Emcore Begins Customer Sampling of OBI-mitigated RFoG ONU Transceiver

7.2.2       MACOM Opens Optoelectronics Innovation Lab in Shenzhen

7.2.3       Finisar Introduces Flextune Feature for Wavelength-Tunable Optical Transceivers

7.2.4       Infinera Claims Milestones for Optical Transport Technologies

7.2.5       Finisar Announces 100G Transceiver Reaches Full Production

7.2.6       Princeton Lightwave Acquired by Argo AI

7.2.7       Applied Optoelectronics Develops 100Gbps per Lambda Lasers

7.3     Other

7.3.1       Philips and IQE Announce Completion of VIDaP Project

7.3.2       Toshiba Optocouplers Target Automotive Battery Systems

7.3.3       Synopsys Enhances Photonic and Optoelectronic Modeling

7.3.4       Brolis Establishes R&D Division for Silicon Photonics in Belgium

7.3.5       Harris Showcases Latest Night Vision Weapon Sight

7.3.6       Sofradir Tropomi Detector Lifts Off on Sentinel-5P Satellite

7.3.7       Lumentum Expands Board

7.3.8       Laird Develops Laser Diode Thermoelectric Module

7.3.9       Apple Invests in Finisar

7.3.10     CSC Announces Magneto-imaging Consortium

7.3.11     OSI Optoelectronics Introduces Silicon Photodiodes

7.3.12     EU PASSION Project to Use VCSELs in New Silicon Photonics Architecture

7.3.13     TriLumina Appoints VP of Engineering

7.3.14     Sanan to Establish LED Production Base

7.3.15     CWDM8 MSA Group Releases Optical Interface Specification

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