Gallium_ArsenideAdvanced Semiconductors

Advanced Semiconductors

Compound Semiconductor Industry Review: July – September 2019



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Report Summary:

After two quarters of revenue declines, there are some encouraging signs from the silicon and equipment portion of the supply chain. SiC seems to be comfortably past the point of inflection in the adoption rate for power electronics applications, as evidenced by Cree’s massive investment in SiC wafer capacity. There is an uptick in process and packaging development and investment.
Table of Contents

1. Executive Summary 7
2. Introduction 8
3. MMICs 9
3.1 Business 9
3.1.1 AGC Acquires Taconic RF Substrate Division 9
3.1.2 Richardson Electronics Reports Fourth Quarter and Fiscal 2019 Results 9
3.1.3 Qorvo Reports Q1 FY ’20 Financials 9
3.1.4 MACOM Reports Q3 FY 2019 Financials 9
3.1.5 Skyworks Reports Q3 FY ’19 Financials 10
3.1.6 Analog Devices Reports Q3 FY ’19 Financials 10
3.2 New Products 10
3.2.1 Skyworks Launches Front-End Modules for Wi-Fi 6 10
3.2.2 Skyworks High Announces Hermetically-Sealed Amplifier MMICs 10
3.2.3 Akoustis Announces Pre-Production of 5.6 GHz Wi-Fi BAW Filter 11
3.2.4 Qorvo Delivers Programmable Power in Smart Home Appliances 11
3.2.5 Richardson RFPD Announces Availability of MACOM Devices 11
3.2.6 Richardson RFPD Announces GaN E-HEMT Eval Board from GaN Systems 12
3.2.7 Richardson RFPD Announces MACOM LNA 12
3.2.8 Qorvo Launches Dual-band Wi-Fi 6 Front-end Module 12
3.2.9 WIN Semiconductors Announces Integrated GaAs Technology 12
3.3 Other 12
3.3.1 Engineer Convicted of Conspiring with China 12
3.3.2 Lockheed Martin Receives APY-9 Radar Award from Northrop Grumman 13
3.3.3 Skyworks Adds to Board of Directors 13
3.3.4 Qorvo's James Klein 2019 Tech Titan Award for Transforming the Tech Industry 13
3.3.5 Akoustis Announces Shipment of 5.6 GHz XBAW Coexistence Filters 13
3.3.6 Skyworks Powers Oculus Quest Virtual Reality Gaming System 14
3.3.7 Qorvo GaN Technology to Upgrade U.S. Army Radar System 14
3.3.8 Murata Starts Volume Production of SAW Duplexers and Filters 14
3.3.9 KYOCERA and Ube Industries Form Joint Venture 14
4. Power Devices 16
4.1 Business 16
4.1.1 Akash Systems Raises $14.5 M in Series A Round 16
4.1.2 Infineon Reports Q3 FY ’19 Financials 16
4.1.3 European Defense Company Selects Baylin to Deliver C/Ku-Band Transmitters 16
4.1.4 EPC Partners with Solace Power on Wireless Power Platforms 16
4.1.5 Delphi Technologies to Partner with Cree for Automotive Silicon Carbide Devices 17
4.1.6 DuPont Electronics & Imaging Divests Compound Semiconductor Solutions Business 17
4.1.7 ST to Supply SiC Power Electronics for On-board Chargers 17
4.2 New Products 17
4.2.1 IDT Announces Wireless Charging Chipset 17
4.2.2 UnitedSiC Adds to SiC FET Packages for the UF3C FAST Series 18
4.2.3 Power Integrations Announces Automotive-Qualified Diodes 18
4.2.4 Transphorm Announces Gen III PQFN88 Transistors 18
4.2.5 Ampleon Launches 12V LDMOS Power Amplifiers 19
4.3 Other 19
4.3.1 DENSO and Toyota to Partner on In-vehicle Semiconductors 19
4.3.2 Transphorm Receives Contract Extension from ONR 19
4.3.3 PowerAmerica Awards Funding Projects to Advance Wide Bandgap Technology 20
4.3.4 Cree Updates SiC Capacity Expansion Plan 20
4.3.5 Diamond Microwave to Market DMD GaN Amplifiers 20
4.3.6 Raytheon to Provide Radars for European Deterrence Initiative 20
4.3.7 EPC Launches Third Edition of GaN Textbook 21
4.3.8 Mitsubishi Electric Develops Trench-type SiC-MOSFET 21
5. Materials & Equipment 22
5.1 Business 22
5.1.1 Soitec Announces First Quarter 2019 Financial Results 22
5.1.2 ASML Announces Second Quarter 2019 Financial Results 22
5.1.3 ASM International Reports Second Quarter 2019 Results 22
5.1.4 Teradyne Reports Second Quarter 2019 Results 22
5.1.5 AXT Announces Second Quarter 2019 Financial Results 23
5.1.6 AIXTRON Reports Improved Profitability in H1/2019 23
5.1.7 Nanometrics Reports Second Quarter 2019 Financial Results 23
5.1.8 IQE 2019 Announces Half-year Results 23
5.1.9 iBeam Materials Funded by Samsung Ventures 24
5.1.10 RIBER Reports 2019 First-half Earnings 24
5.2 Contracts 24
5.2.1 AIXTRON Provides MOCVD system to Nagoya University 24
5.2.2 ACM Research Expands Memory Customer Base 24
5.2.3 IQE Announces Asian Wireless Materials Qualification Update 25
5.2.4 IQE Announces VCSEL Production at Newport Mega Foundry 25
5.2.5 Cree and ON Semi Announce Multi-Year SiC Wafer Supply Agreement 25
5.2.6 Trymax Receives Order from Eindhoven University of Technology 26
5.2.7 Aehr Receives Order for FOX-XP System 26
5.3 Other 26
5.3.1 EV Group Unveils Maskless Exposure Technology 26
5.3.2 CST Global Becomes Partner In EU-funded Fabrication Project 27
5.3.3 Soitec and Kokusai Electric Expand Strategic Technology Partnership 27
5.3.4 Paragraf Producing Graphene at Commercial Scale 27
5.3.5 UnitySC Unveils Packaging and Wafer Processing System 27
5.3.6 Picosun Launches ALD Product Platform 28
5.3.7 SEMI Announces 2019 Mid-Year Total Equipment Forecast 28
5.3.8 UKRPIF Announces Semiconductor Materials Investment 28
5.3.9 Amtech Announces Investments in SiC, Optics, and Silicon 28
5.3.10 Samsung Explores Non-Japanese Suppliers of Hydrogen Fluoride 28
5.3.11 Teradyne Debuts UltraWaveMX44 Millimeter Wave Test Solution 29
5.3.12 Aehr Test Systems Appoints Laura Oliphant to Board of Directors 29
5.3.13 IQE Organizational Structure Continues to Evolve 29
5.3.14 AIXTRON Completes 2D Nanomaterials Process Development Project 29
5.3.15 StratEdge Expands Packaging and Assembly Services 30
5.3.16 Thermo Fisher Scientific Introduces Scalable Optical Fault Isolation Solution 30
5.3.17 Axcelis Appoints New Board Member 30
5.3.18 Toppan Photomasks and GLOBALFOUNDRIES Enter Supply Deal 30
5.3.19 Welsh Government Announces Semiconductor Process Development Funding 31
5.3.20 EV Group and SCHOTT Partner on Glass Manufacturing 31
5.3.21 Evatec Delivers CLUSTERLINE Tool to Supports Custom Foundry Programs 31
5.3.22 Soitec Announces New CFO 32
5.3.23 Altum RF Announces RF Test Lab in Sydney 32
5.3.24 Soitec Adds Piezoelectric-On-Insulator Substrate Capacity 32
5.3.25 Axcelis Expands Purion Platform 32
5.3.26 Lam Research to Set Up New Technology Center in South Korea 32
5.3.27 ASM International Announces Retirement of CEO 33
5.3.28 AIXTRON Presents Next-gen SiC Epi Production System 33
6. Silicon Devices 34
6.1 Business 34
6.1.1 TSMC Reports Q2 FY ‘19 Financials 34
6.1.2 Silicon Labs Reports Q2 FY ’19 Financials 34
6.1.3 UMC Reports Q2 FY ’19 Financials 34
6.1.4 STMicroelectronics Reports 2019 Second Quarter Financial Results 34
6.1.5 Cypress Reports Q2 FY 2019 Financials 34
6.1.6 Fujitsu Reports Q1 FY ’19 Financials 35
6.1.7 NXP Reports Q2 FY ’19 Financials 35
6.1.8 Maxim Reports Q4 and FY ’19 Financials 35
6.1.9 Seiko-Epson Reports Q1 FY ‘20 Financials 35
6.1.10 Sony Reports Q1 FY ’20 Financials 36
6.1.11 Qualcomm Reports Q3 FY ‘19 Financials 36
6.1.12 Mid-Year Global Semiconductor Sales Down Compared to 2018 36
6.1.13 Synopsys to Acquire QTronic 36
6.1.14 Global Semiconductor Sales Decrease in July 36
6.1.15 Erik Pederson Joins Semiconductor Industry Association 37
6.1.16 UMC Receives Final Approval for Acquisition of Mie Fujitsu Semiconductor 37
6.2 New Products 37
6.2.1 GLOBALFOUNDRIES and Arm Demonstrate 3D Stack Test Chip 37
6.2.2 GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution 37
6.3 Other 38
6.3.1 pSemi Announces New Leadership Structure 38
6.3.2 Jim Cable Chosen by Murata for Semiconductor Expansion Evaluation 38
6.3.3 DENSO and Toyota Establish JV for In-vehicle Semiconductors 38
6.3.4 TowerJazz, Cadence and Lumerical Announce PDK 39
6.3.5 MOSIS Service Selects Synopsys' IC Validator for Large-scale FinFET SoCs 39
6.3.6 North America Semi Equipment Industry Billings Up Slightly, Says SEMI 39
6.3.7 sureCore Unveils Low Power Design Service 39
6.3.8 GLOBALFOUNDRIES Files Patent-infringement Lawsuits against TSMC 39
6.3.9 Imec and NUS to Collaborate on Chip-Based Quantum Cryptography Technology 40
6.3.10 BAE Systems Receives Technology Contract 40
6.3.11 SMART Announces Manufacture Technique to Integrate Silicon III-V Chips 40
6.3.12 Multibeam Receives Contract for MEBL-Embedded Chip ID 40
7. Optoelectronic Devices 42
7.1 Business 42
7.1.1 SEI Reports Q1 FY ’19 Financials 42
7.1.2 II-VI Reports Q4 and FY ’19 Financials 42
7.1.3 Cree Reports Q4 and FY ’19 Financials 42
7.1.4 POET Technologies Reports Second Quarter 2019 Financial Results 42
7.1.5 Luna Innovations Reports Strong Second-Quarter 2019 Results 43
7.1.6 II-VI Announces Reclassified Segment Information 43
7.1.7 II-VI Obtains Regulatory Approvals to Complete Acquisition of Finisar 43
7.2 Datacom 43
7.2.1 Cardiff Researchers Create Low Noise Compound Avalanche Diode 43
7.2.2 AirBorn Launches Space-rated Active Optical Cable 44
7.2.3 VI Systems VCSEL Test Boards for up to 70 Gbit/s NRZ 44
7.2.4 Fujitsu and Qualcomm Complete Sub-6 GHz and mmWave 5G Data Calls 44
7.2.5 MACOM Showcasing Optoelectronics and Photonic Components at CIOE 45
7.2.6 NeoPhotonics Launches Multiplexers and De-multiplexers 45
7.2.7 Synopsys Enhances Portfolio of Photonic Design Solutions 45
7.2.8 Skorpios Demos 400G CWDM8 Transceiver 45
7.2.9 IDT Releases 64G Linear Trans-Impedance Amplifier for Coherent Applications 46
7.2.10 IQE VCSEL Qualification Update 46
7.3 Other 46
7.3.1 Artilux Announces GeSi 3D Sensing Technology 46
7.3.2 Bridgelux Announces New Vice President of Marketing 46
7.3.3 II-VI and LITE-ON Partner on LiDAR 47
7.3.4 Emcore Appoints Noel Heiks to Board 47
8. How Can We Help You? 48
 
 

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