Advanced Semiconductors

Compound Semiconductor Industry Review: April - June 2019




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Report Summary:

Another quarter with nearly universally negative financial results across all the segments covered in this report. Seasonality, softening of the smartphone market and political tensions with China may explain some of this trend, but it merits close scrutiny. There was substantial acquisition and new process activity announced this quarter that may influence the future direction of the industry. 

Table of Contents

1. Executive Summary 7
2. Introduction 8
3. MMICs 9
3.1 Business 9
3.1.1 MACOM Announces CFO Resignation 9
3.1.2 Qorvo to Acquire Active-Semi International 9
3.1.3 Mercury Systems Announces Acquisitions 9
3.1.4 Skyworks Reports Q2 FY ’19 Financials 10
3.1.5 MACOM Reports Q2 FY 2019 Financials 10
3.1.6 Qorvo Reports Q4 and FY ’19 Financials 10
3.1.7 SEI Reports Q4 and FY ’18 Financials 10
3.1.8 Amplitech Acquires Specialty Microwave 10
3.1.9 Skyworks Updates Q3 FY19 Outlook 11
3.2 New Products 11
3.2.1 Pasternack Expands LNA Portfolio 11
3.2.2 Akoustis Announces New Shipments of 5.2 GHz XBAW Filters 11
3.2.3 Skyworks Launches Custom Waveguide Circulators for 5G Infrastructure 12
3.2.4 RFIC Solutions to Launch Advanced MMIC Solutions for 5G at IMS2019 12
3.2.5 WIN Semiconductors’ Announces Millimeter Wave Integrated GaAs Process 12
3.2.6 Qorvo Announces Small Cell Infrastructure Products 13
3.2.7 WIN Semi Introduces New GaN Process 13
3.2.8 Qorvo Introduces GaN Power Amplifiers for SATCOM and Radar Applications 13
3.2.9 Anokiwave Introduces 24/26 GHz Beamforming ICs for 5G 13
3.2.10 MACOM Releases Distributed Amplifier 14
3.2.11 Menlo Micro Unveils 20 GHz RF MEMS Switch 14
3.2.12 MACOM Unveils Ka-Band Power Amplifier for SATCOM Applications 14
3.2.13 Skyworks Showcasing 5G Infrastructure Solutions at IMS 2019 14
3.2.14 Qorvo Develops Ka-Band GaN Amplifier 15
3.2.15 MACOM Unveils 40 GHz Amplifier 15
3.2.16 Guerrilla RF Releases New Power Amplifier Products 15
3.3 Contracts 15
3.3.1 Syrlinks Selects Qorvo Amplifiers for New Space Applications 15
3.4 Other 16
3.4.1 NXP to Develop 77 GHz Automotive Radar Designs for the Chinese Market 16
3.4.2 IQE Unveils Advanced RF Filter Materials Portfolio 16
3.4.3 Altum RF Names VP of Engineering 16
3.4.4 Akash Systems Appoints Vice President of Radios 16
3.4.5 Filtronic Develops E-band Transceiver Modules with Data Rates up to 10 Gbps 17
3.4.6 Mitsubishi Launches Satellite Division 17
3.4.7 MACOM Demonstrates its Range of W-Band Components 17
3.4.8 MACOM Restructures to Cut 20% of its Workforce and Close 7 Facilities 17
4. Power Devices 18
4.1 Business 18
4.1.1 Cree Reports Q3 FY ’19 Financials 18
4.1.2 WiBotic and GaN Systems Partner on Wireless Charging 18
4.1.3 SEC Charges GTAT and Former CEO with Fraud 18
4.1.4 Infineon Reports Q2 FY ’19 Financials 19
4.2 New Products 19
4.2.1 EPC Expands 100V eGaN FET Family 19
4.2.2 ROHM Expands its Range of Power Devices 19
4.2.3 Arralis Announces 10W K-band GaN MMIC HPA 19
4.2.4 Ampleon Develops 750W RF Power Transistor 20
4.2.5 KYOCERA and Vicor to Collaborate on Package Solutions 20
4.2.6 Vishay Siliconix and TowerJazz Expand Manufacturing Collaboration 20
4.2.7 EPC Adds 80V eGaN FET to AEC Q101-qualified Product Family 20
4.2.8 ROHM Expands Super Junction MOSFET Portfolio 21
4.2.9 ROHM Announces Power Management ICs 21
4.2.10 Wolfspeed Introduces SiC Product Portfolio 21
4.2.11 ROHM Develops AC/DC Converter ICs with Built-in 1700V SiC MOSFET 21
4.2.12 UnitedSiC Expands SiC FET Portfolio 22
4.2.13 Toyoda Gosei Develops 100A Vertical GaN Device 22
4.2.14 EPC and Spirit Electronics Announce Partnership 22
4.2.15 Advantech Wireless Releases GaN-based SSPA/BUC 22
4.2.16 UnitedSiC Expands UF3C FAST FET Series 22
4.2.17 Richardson RFPD Announces SiC-MOSFET Gate Driver from Power Integrations 23
4.2.18 Transphorm Adds Second 900V GaN FET 23
4.2.19 Power Integrations Introduces Gate-Driver System 23
4.2.20 Alpha and Omega Semiconductor Releases MOSFET Families 23
4.3 Other 24
4.3.1 Altum RF Announces New CEO 24
4.3.2 Imec Demos Fully Monolithic Co-integration of GaN Half-bridge with Drivers 24
4.3.3 Fraunhofer Enhance Functionality of GaN Power ICs 24
4.3.4 Exagan Opens Power Solutions Center 24
4.3.5 Cree to Invest $1 Billion to Expand Silicon Carbide Capacity 25
4.3.6 Cree Selected as Silicon Carbide Partner for the FAST Program 25
4.3.7 Integra to Exhibit X-Band Radar Transistor 25
4.3.8 First Digital Circuit Breaker Gets UL Certification 25
4.3.9 Transphorm Receives GaN Material Contract 26
4.3.10 Integra Technologies Accelerates GaN Readiness for US Air Force 26
4.3.11 Northrop Grumman Awarded G/ATOR Contract 26
4.3.12 Sanan IC Launches GaN-on-Si E-HEMT Process for Power Electronics 26
5. Materials & Equipment 27
5.1 Business 27
5.1.1 Bruker Announces Acquisition of RAVE 27
5.1.2 RIBER Reports 2018 Financials 27
5.1.3 Soitec Reports Results for Fourth Quarter 27
5.1.4 Lam Research Reports Results for Quarter Ended March 31, 2019 27
5.1.5 AXT Announces First Quarter 2019 Financial Results 28
5.1.6 AIXTRON Reports Results for First Quarter 28
5.1.7 Veeco Reports First Quarter 2019 Financial Results 28
5.1.8 Soitec Acquires EpiGaN 28
5.1.9 Report Says AIXTRON MOCVD Market Leader 29
5.1.10 IQE Trading Update 29
5.1.11 Nanometrics and Rudolph Announce Merger Agreement 29
5.1.12 EVG Invests in Capacity Expansion 29
5.2 Contracts 30
5.2.1 Applied Optoelectronics Orders MOCVD Technology from AIXTRON 30
5.2.2 Decawave Chooses LitePoint Test Solutions 30
5.2.3 Axcelis Announces First Order for Purion XE Power Series Implanter 30
5.3 Other 31
5.3.1 Global Semiconductor Sales Decrease Month-to-Month in February 31
5.3.2 Global Semiconductor Materials Sales Hit New High 31
5.3.3 AccuStrata Introduces New In-Situ Monitoring System 31
5.3.4 North American Semiconductor Equipment Industry Posts March 2019 Billings 31
5.3.5 HexaTech Demonstrates Defect-free 2-inch AlN Substrate 32
5.3.6 Keysight Launches Dynamic Power Device Analyzer 32
5.3.7 SemiGen to Exhibit Advanced Foundry and Thin Film Capabilities at IMS2019 32
5.3.8 North American Semiconductor Equipment Industry Posts April 2019 Billings 32
5.3.9 5G mmWave Semiconductor Wafer Probe Test Solution Demonstrated 32
5.3.10 Element Six Launches New Diamond Thermal Material Grade Diafilm 33
5.3.11 Intevac Announces Board of Directors Appointments 33
5.3.12 Okmetic to Double SoI Wafer Production Capacity 33
5.3.13 EV Group Unveils 300mm Nanoimprint Lithography Track System 33
5.3.14 Global Fab Equipment Spending to Rebound in 2020 34
5.3.15 AIXTRON is a Partner in “UltimateGaN” Research Project 34
5.3.16 OIPT Launches Atomfab High-volume ALD for GaN Power Device Passivation 34
6. Silicon Devices 35
6.1 Business 35
6.1.1 TSMC Reports Q1 FY ‘19 Financials 35
6.1.2 Photronics Celebrates Opening of China Manufacturing Facilities 35
6.1.3 ON Semiconductor and GLOBALFOUNDRIES Enter Fab Agreement 35
6.1.4 UMC Reports Q1 FY ’19 Financials 36
6.1.5 Cypress Reports Q1 FY 2019 Financials 36
6.1.6 Fujitsu Reports Q4 and FY ‘18 Financials 36
6.1.7 ROHM to Takeover Panasonic Semiconductor Diode and Transistor Business 36
6.1.8 Qualcomm Reports Q2 FY 2019 Financials 37
6.1.9 Microchip Reports Q4 and FY ’19 Financials 37
6.1.10 Renesas Reports Q1 FY ’19 Financials 37
6.1.11 TowerJazz Reports Q1 FY ‘19 Financials 37
6.1.12 Marvell to Acquire Avera Semiconductor from GlobalFoundries 37
6.1.13 Analog Devices Reports Q2 FY ’19 Financials 38
6.1.14 Infineon to Acquire Cypress Semiconductor 38
6.1.15 Global Semiconductor Sales Decrease 14.6% Year-to-Year in April 38
6.1.16 Jury Finds Huawei Misappropriated CNEX’s Trade Secrets 39
6.2 New Products 39
6.2.1 Samsung Announces Production of Multi-Mode Exynos Chipsets 39
6.2.2 Silicon Line Introduces Integrated Circuits for Active Optical Cables 39
6.2.3 Anokiwave Announces Gen 2 Ku-Band Silicon Beamformer ICs 39
6.2.4 Ampleon Expands LDMOS RF Transistor portfolio 40
6.2.5 RFIC Solutions Launches MMIC Solutions at IMS2019 40
6.2.6 ADI's Introduces RF Converters for 4G Base Stations 40
6.3 Other 41
6.3.1 Global Semiconductor Sales Decrease in February 41
6.3.2 pSemi Appoints New Vice President of Intellectual Property and Licensing 41
6.3.3 2018 Global Semiconductor Equipment Sales Hit a Record 41
6.3.4 Synopsys Design Platform Certified for TSMC SoIC Chip Stacking Technology 41
6.3.5 Lam Research Achieves Record Productivity with Self-Maintaining Equipment 42
6.3.6 Anokiwave Inc. Names Chief Strategy Officer 42
6.3.7 Akoustis Receives Pre-Production Order for Tandem 5.2/5.6 GHz Wi-Fi Filter 42
6.3.8 Semiconductor Leaders Strike Agreement on Global Policy Agenda 42
6.3.9 NXP to Acquire Marvell Wi-Fi and Bluetooth Connectivity Assets 43
6.3.10 pSemi Corporation to Offer Free Beta Software 43
6.3.11 pSemi Introduces Next Generation of UltraCMOS RF SOI Technology 43
6.3.12 GLOBALFOUNDRIES and Soitec Announce Wafer Supply Agreements 44
6.3.13 ON Semiconductor Completes Acquisition of Quantenna Communications 44
6.3.14 GLOBALFOUNDRIES Adds to its Board of Directors 44
6.3.15 Renesas Names New CEO 44
6.3.16 TowerJazz and Lumotive Demonstrate Beam Steering for LiDAR Systems 44
7. Optoelectronic Devices 45
7.1 Business 45
7.1.1 POET Technologies Reports Full Year 2018 Financial Results 45
7.1.2 EMCORE Reports Second Quarter Results 45
7.1.3 NeoPhotonics Reports Second Quarter Results 45
7.1.4 Cree Closes Sale of Cree Lighting to Ideal Industries 46
7.1.5 Sofradir and ULIS Become Lynred 46
7.2 Datacom 46
7.2.1 Open Eye MSA Formed to Speed Adoption of PAM4 Interconnects 46
7.3 Other 46
7.3.1 Vishay Intertechnology Expands Optoelectronics Component 46
7.3.2 UCLA and Cardiff Deliver Uncooled Nanowire SWIR/MWIR Detectors 47
7.3.3 Emcore Introduces 1.8 GHz Cable Broadband Devices 47
7.3.4 II-VI Introduces Laser Bars and Semi-framed Stacks 47
8. How Can We Help You? 48
 

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