Table of Contents
1. Executive Summary
2. Introduction
3. Company Profiles
3.1 Ampleon
3.1.1 Strategic Position & Comment
3.1.2 Revenues
3.1.3 Facilities
3.1.4 Processes
3.1.5 Products
3.1.6 Selected GaN-related News Items
3.2 ANADIGICS
3.2.1 Strategic Position & Comment
3.2.2 Revenues
3.2.3 Facilities
3.2.4 Processes
3.2.5 Products
3.2.6 Selected GaN-related News Items
3.3 Analog Devices
3.3.1 Strategic Position & Comment
3.3.2 Revenues
3.3.3 Facilities
3.3.4 Processes
3.3.5 Products
3.3.6 Selected GaN-related News Items
3.4 BAE Systems Microelectronics Center
3.4.1 Strategic Position & Comment
3.4.2 Revenues
3.4.3 Facilities
3.4.4 Processes
3.4.5 Products
3.5 Custom MMIC
3.5.1 Strategic Position & Comment
3.5.2 Revenues
3.5.3 Facilities
3.5.4 Processes
3.5.5 Products
3.5.6 Selected GaN-related News Items
3.6 Efficient Power Conversion Corporation
3.6.1 Strategic Position & Comment
3.6.2 Revenues
3.6.3 Facilities
3.6.4 Processes
3.6.5 Products
3.6.6 GaN-related News Items
3.7 EPISIL
3.7.1 Strategic Position & Comment
3.7.2 Revenues
3.7.3 Facilities
3.7.4 Processes
3.7.5 Products
3.8 GaN Systems
3.8.1 Strategic Position & Comment
3.8.2 Revenues
3.8.3 Facilities
3.8.4 Processes
3.8.5 Products
3.8.6 Selected GaN-related News Items
3.9 Global Communication Semiconductors
3.9.1 Strategic Position & Comment
3.9.2 Revenues
3.9.3 Facilities
3.9.4 Processes
3.9.5 Products
3.10 Gotmic
3.11 HRL Laboratories
3.11.1 Strategic Position & Comment
3.11.2 Revenues
3.11.3 Facilities
3.11.4 Processes
3.11.5 Products
3.12 Imec
3.12.1 Revenues
3.12.1 Strategic Position & Comment
3.12.2 Facilities
3.12.3 Processes
3.12.4 Products
3.12.5 Selected GaN-related News Items
3.13 Infineon Technologies
3.13.1 Strategic Position & Comment
3.13.2 Revenues
3.13.1 Facilities
3.13.2 Processes
3.13.3 Products
3.14 Integra Technologies
3.14.1 Strategic Position & Comment
3.14.2 Revenues
3.14.3 Facilities
3.14.4 Processes
3.14.5 Products
3.15 M/A-COM Technology Solutions
3.15.1 Strategic Position & Comment
3.15.2 Revenues
3.15.3 Facilities
3.15.4 Processes
3.15.5 Products
3.15.6 Selected GaN-related News Items
3.16 Microsemi
3.16.1 Strategic Position & Comment
3.16.2 Revenues
3.16.3 Facilities
3.16.4 Processes and Products
3.16.5 Processes
3.16.6 Products
3.16.7 Selected GaN-related News Items
3.17 Microwave Technology
3.17.1 Strategic Position & Comment
3.17.2 Revenues
3.17.3 Facilities
3.17.4 Processes
3.17.5 Products
3.18 Mini-Circuits
3.18.1 Strategic Position & Comment
3.18.2 Revenues
3.18.3 Facilities
3.18.4 Processes
3.18.5 Products
3.19 Mitsubishi Electric
3.19.1 Strategic Position & Comment
3.19.2 Revenues
3.19.3 Processes
3.19.4 Products
3.19.5 Selected GaN-related News Items
3.20 National Research Council of Canada
3.21 Northrop Grumman
3.21.1 Strategic Position & Comment
3.21.2 Revenues
3.21.3 Facilities
3.21.4 Processes
3.21.5 Products
3.21.6 Selected GaN-related News Items
3.22 NXP
3.22.1 Strategic Position & Comment
3.22.2 Revenues
3.22.3 Facilities
3.22.4 Processes
3.22.5 Products
3.22.6 Selected GaN-related News Items
3.23 Ommic
3.23.1 Strategic Position & Comment
3.23.2 Revenues
3.23.3 Facilities
3.23.4 Processes
3.23.5 Products
3.24 Plextek RFI
3.24.1 Strategic Position & Comment
3.24.2 Revenues
3.24.3 Facilities
3.24.4 Processes
3.24.5 Selected GaN-related News Items
3.25 Qorvo
3.25.1 Strategic Position & Comment
3.25.2 Revenues
3.25.3 Facilities
3.25.4 Processes
3.25.5 Products
3.25.6 Selected GaN-related News Items
3.26 Raytheon Radio Frequency Components
3.26.1 Strategic Position & Comment
3.26.2 Revenues
3.26.3 Facilities
3.26.4 Processes
3.26.5 Products
3.26.6 Selected GaN-related News Items
3.27 RF Integration
3.27.1 Strategic Position & Comment
3.27.2 Revenues
3.27.3 Facilities
3.27.4 Processes
3.27.5 Products
3.28 RFHIC Corporation
3.28.1 Strategic Position & Comment
3.28.2 Revenues
3.28.3 Facilities
3.28.4 Processes
3.28.5 Products
3.29 Roke Manor Research
3.29.1 Strategic Position & Comment
3.29.2 Revenues
3.29.3 Facilities
3.29.4 Processes
3.29.5 Products
3.30 Selex
3.30.1 Strategic Position & Comment
3.30.2 Revenues
3.30.3 Facilities
3.30.4 Processes
3.30.5 Products
3.31 Sumitomo Electric Device Innovations
3.31.1 Strategic Position & Comment
3.31.2 Revenues
3.31.3 Facilities
3.31.4 Processes
3.31.5 Products
3.31.6 Selected GaN-related News Items
3.32 Toshiba
3.32.1 Strategic Position & Comment
3.32.2 Revenues
3.32.3 Facilities
3.32.4 Processes
3.32.5 Products
3.33 Transphorm
3.33.1 Strategic Position & Comment
3.33.2 Revenues
3.33.3 Facilities
3.33.4 Processes
3.33.5 Products
3.33.6 Selected GaN-related News Items
3.34 TSMC
3.34.1 Strategic Position & Comment
3.34.2 Revenues
3.34.3 Facilities
3.34.4 Processes
3.34.5 Products
3.35 United Monolithic Semiconductors
3.35.1 Strategic Position & Comment
3.35.2 Revenues
3.35.3 Facilities
3.35.4 Processes
3.35.5 Products
3.35.6 Selected GaN-related News Items
3.36 WIN Semiconductors
3.36.1 Strategic Position & Comment
3.36.2 Revenues
3.36.3 Facilities
3.36.4 Processes
3.36.5 Products
3.36.6 Selected GaN-related News Items
3.37 Wolfspeed
3.37.1 Strategic Position & Comment
3.37.2 Revenues
3.37.3 Facilities
3.37.4 Processes
3.37.5 Products
3.37.6 Selected GaN-related News Items