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Powertrain, Body, Chassis and Safety

TI puts Si brains behind GaN brawn for High Voltage xEV Applications



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Report Summary:

Wide-bandgap semiconductor technologies like GaN inherently bring firmly established capabilities to power electronics, especially for high voltage systems. Texas Instruments leverages over a decade of investment and development to deliver a uniquely holistic approach – combining internal GaN-on-Si device production and packaging with optimized Si driver technology to successfully implement GaN in new applications.

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