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1. Executive Summary
2. Introduction
   • 2.1.Key Trends
   • 2.2.Abbreviations Used in This Report
3. Exhibitor Summary
   • 3.1.AdaSky
   • 3.2.AEye
   • 3.3.Aisin Seiki
   • 3.4.AllGo (Visteon)
   • 3.5.Alpine
   • 3.6.Alps Electric
   • 3.7.Ambarella
   • 3.8.Aptiv (formerly Delphi)
   • 3.9.Autoaid
   • 3.10.Autoliv
   • 3.11.Baidu
   • 3.12.Benewake
   • 3.13.Blackberry QNX
   • 3.14.Bosch
   • 3.15.BreezoMeter
   • 3.16.Byton
   • 3.17.Cepton
   • 3.18.Chronocam
   • 3.19.Civil Maps
   • 3.20.Cognata
   • 3.21.Continental
   • 3.22.Cypress
   • 3.23.Daimler
   • 3.24.Deep Force
   • 3.25.DENSO
   • 3.26.Elaphe
   • 3.27.Elektrobit
   • 3.28.eTrans
   • 3.29.EXO Technologies
   • 3.30.Faurecia
   • 3.31.Fisker
   • 3.32.FLIR Systems
   • 3.33.Ford
   • 3.34.Foresight Automotive
   • 3.35.Future Mobility
   • 3.36.Garmin
   • 3.37.Gentex
   • 3.38.Green Hills Software
   • 3.39.Guardian Optical Technologies
   • 3.40.Hamamatsu
   • 3.41.Harman
   • 3.42.HERE
   • 3.43.Honda
   • 3.44.Honeywell
   • 3.45.Horizon Robotics
   • 3.46.HPB Optoelectronics
   • 3.47.Hyundai
   • 3.48.Infineon
   • 3.49.Innoviz
   • 3.50.Intel
   • 3.51.Jimu Intelligent
   • 3.52.Jungo Connectivity
   • 3.53.Kia
   • 3.54.Koito/North American Lighting
   • 3.55.KPIT
   • 3.56.Lattice Semiconductor
   • 3.57.LeddarTech
   • 3.58.LiteOn
   • 3.59.Luminar Technologies
   • 3.60.Luxoft
   • 3.61.Magna
   • 3.62.Magneti-Marelli
   • 3.63.Marvell Semiconductor
   • 3.64.Maxim Integrated
   • 3.65.MCNEX
   • 3.66.Mentor
   • 3.67.Metawave
   • 3.68.Microchip
   • 3.69.MINIEYE
   • 3.70.Mitsubishi Electric
   • 3.71.Mobileye
   • 3.72.Mobis
   • 3.73.Molex
   • 3.74.Murata
   • 3.75.Navya
   • 3.76.Nidec
   • 3.77.Nissan
   • 3.78.NVIDIA
   • 3.79.NXP
   • 3.80.OmniVision
   • 3.81.OMRON
   • 3.82.ON Semiconductor
   • 3.83.OPTIS
   • 3.84.OSRAM
   • 3.85.Ouster
   • 3.86.Panasonic
   • 3.87.Phantom Auto
   • 3.88.Pioneer
   • 3.89.Plessey Semiconductor
   • 3.90.PLK Technologies
   • 3.91.PolySync
   • 3.92.ProLogium
   • 3.93.Qorvo
   • 3.94.Qt
   • 3.95.Qualcomm
   • 3.96.Quanergy
   • 3.97.Renesas
   • 3.98.Rinspeed
   • 3.99.RoboSense
   • 3.100.ROHM
   • 3.101.Samsung
   • 3.102.SENSSIGHT
   • 3.103.SLD
   • 3.104.SmartEye
   • 3.105.Sony
   • 3.106.Stanley Electric
   • 3.107.ST Microelectronics
   • 3.108.Taoglas
   • 3.109.TetraVue
   • 3.110.Texas Instruments
   • 3.114.TomTom
   • 3.112.Toyota
   • 3.113.TuSimple
   • 3.114.Valens (HDBaseT)
   • 3.115.Valeo
   • 3.116.Vayyar
   • 3.117.Velodyne
   • 3.118.Videantis
   • 3.119.Visteon
   • 3.120.Voxx
   • 3.121.WayRay
   • 3.122.WiTricity
   • 3.123.Workhorse
   • 3.124.Xilinx
   • 3.125.Xpeng (Xiaopeng) Motor
   • 3.126.Yamaha
   • 3.127.Ygomi
   • 3.128.ZF
4. Automakers Autonomous Vehicle Strategy
   • 4.1.Autonomous Becomes More Challenging
     • 4.1.1. Cross Domain Hypervisor
     • 4.1.2. Virtual Simulation
     • 4.1.3. Software Binary Checking
   • 4.2.Byton
   • 4.3.Fisker
   • 4.4.Ford
   • 4.5.Hyundai
   • 4.6.Kia
   • 4.7.Navya
   • 4.8.Nissan
   • 4.9.Toyota
5. ADAS / Autonomous Driving Applications
   • 5.1.Adaptive Front Lighting Systems
   • 5.2.Driver Monitoring Systems
     • 5.2.1. Autoliv
     • 5.2.2. Deep Force
     • 5.2.3. Jungo Connectivity
     • 5.2.4. OMRON
     • 5.2.5. RADAR Support
     • 5.2.6. Display Screen Activation
     • 5.2.7. Other Developments
   • 5.3.Door Opening Alert/Prevention
   • 5.4.Mapping Data Generation
     • 5.4.1. Civil Maps
     • 5.4.2. Ygomi
   • 5.5.Occupant Sensing
     • 5.5.1. Guardian Optical Technologies
     • 5.5.2. Plessey Semiconductor
     • 5.5.3. Vayyar
     • 5.5.4. Other Approaches
   • 5.6.Remote Control Driving
   • 5.7.V2X
6. ADAS / Autonomous Driving Sensors
   • 6.1.LiDAR
     • 6.1.1. Sample Scanning
     • 6.1.2. MEMS Micro Mirror Scanning
     • 6.1.3. Mechanically-Scanning LiDAR
     • 6.1.4. Flash LiDARs
     • 6.1.5. Others
   • 6.2.Night Vision
     • 6.2.1. AdaSky
     • 6.2.2. FLIR Systems
     • 6.2.3. Foresight Automotive
   • 6.3.RADAR
     • 6.3.1. Next Generation RADARs
     • 6.3.2. CMOS RADAR and Imaging RADAR
     • 6.3.3. Metamaterial RADAR
   • 6.4.Cameras
     • 6.4.1. Event-Driven Cameras
     • 6.4.2. Structured Light Sensing
     • 6.4.3. Biometric Sensing
7. ADAS / Autonomous Driving Processing
   • 7.1.Autonomous Vehicle Central Processing
     • 7.1.1. NVIDIA
     • 7.1.2. Intel
     • 7.1.3. NXP
     • 7.1.4. Samsung
   • 7.2.Machine Vision
     • 7.2.1. Ambarella
     • 7.2.2. Lattice Semiconductor
     • 7.2.3. NXP
     • 7.2.4. Renesas
     • 7.2.5. Texas Instruments
     • 7.2.6. Videantis
     • 7.2.7. Aftermarket Providers
   • 7.3.LiDAR Control
   • 7.4.Positioning Correction
8. Head-Up Displays
   • 8.1.Augmented Reality HUDs
     • 8.1.1. Daimler
     • 8.1.2. Honda/WayRay
     • 8.1.3. NVIDIA
   • 8.2.DLP
     • 8.2.1. Microchip
   • 8.3.Micro LED
     • 8.3.1. Plessey Semiconductor
9. Instrument Clusters
   • 9.1.Single Processor Cockpits
   • 9.2.Emergence of OLED
   • 9.3.Capacitive Sensing
   • 9.4.Other
10. In-Vehicle Networking & Communication
    • 10.1.HDBaseT
    • 10.2.Ethernet
    • 10.3.Serial Links
11. Electric Powertrain
    • 11.1.Model Launches, Concept Previews
      • 11.1.1.Byton
      • 11.1.2.Fisker
      • 11.1.3.Hyundai
      • 11.1.4.Kia
      • 11.1.5.Workhorse
      • 11.1.6.Xpeng (Xiaopeng) Motor
    • 11.2.Supplier Developments
      • 11.2.1.Continental
      • 11.2.2.Elaphe
      • 11.2.3.Magneti-Marelli
      • 11.2.4.Maxim Integrated
      • 11.2.5.Microchip
      • 11.2.6.Mobis
      • 11.2.7.Panasonic
      • 11.2.8.ProLogium
      • 11.2.9.ROHM
      • 11.2.10. ST Microelectronics
      • 11.2.11. Valeo
      • 11.2.12. ZF
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