Powertrain_Body_Chasis&SafetyPowertrain, Body, Chassis & Safety

Powertrain, Body, Chassis and Safety

CES 2021: Virtual Event Continues Emphasis on Electrification, ADAS/Automation, Driver Infotainment and Centralized Architectures



Report Summary:

This year’s virtual CES 2021 continued on from CES 2020 with automotive industry innovations pivoting towards offerings focused on electrification, ADAS/automation, driver infotainment and centralized architectures. Other notable product areas included digital keys, lighting, tactile sensing and cloud data analytics.
Table of Contents

1. Executive Summary

2. Introduction

3. Powertrain Electrification

3.1 Vehicle Platforms

3.1.1 General Motors - Keynote

3.1.2 Cenntro

3.1.3 Sono Motors

3.1.4 Sony

3.1.5 XAOS Motors

3.2 Platforms and Systems

3.2.1 Applied EV

3.2.2 Geotab

3.2.3 LG/Magna

3.2.4 Panasonic

3.2.5 REE Automotive

3.3 Semiconductors and Sensors

3.3.1 Current Sensors

3.3.2 GaN and SiC

3.3.3 Wireless Battery Management Systems

4. Body and Chassis

4.1 Body and Chassis Systems

4.1.1 ams

4.1.2 BMW

4.1.3 Bosch

4.1.4 Mando

4.1.5 GHSP

4.1.6 Grupo Antolin

4.1.7 Innolux

4.1.8 Koito/NAL

4.1.9 Magna

4.1.10 Maxim

4.1.11 OSRAM

4.1.12 Rohm

4.1.13 Schaeffler

4.1.14 TDK/InvenSense

4.2 Software

4.2.1 Green Hills Hypervisor

4.2.2 SafeRide

4.2.3 Tactile Mobility

4.2.4 ZF

5. Safety

5.1 Camera/Image Sensors

5.1.1 ams

5.1.2 Mcnex

5.1.3 OmniVision

5.1.4 Sony

5.1.5 Other Camera Developments

5.2 LiDAR

5.2.1 Aeva

5.2.2 Blickfeld

5.2.3 Cepton

5.2.4 Cygbot

5.2.5 Ibeo

5.2.6 Innoviz

5.2.7 Intel/Mobileye

5.2.8 Leddartech

5.2.9 Pioneer

5.2.10 Robosense

5.2.11 SOS Lab

5.2.12 Velodyne

5.3 Night Vision Sensors

5.3.1 Koito/NAL

5.3.2 TriEye

5.4 Radar

5.4.1 Aptiv

5.4.2 Arbe

5.4.3 Continental

5.4.4 NXP

5.4.5 Uhnder

5.4.6 Vayyar

6. Driver Infotainment & Connectivity

6.1 Connectivity

6.1.1 Airgain

6.1.2 Harman

6.1.3 HERE

6.1.4 Qorvo

6.2 Driver Infotainment

6.2.1 Continental

6.2.2 Harman

6.2.3 Mercedes-Benz

6.2.4 Panasonic

6.2.5 Qualcomm

6.2.6 Samsung

6.2.7 Visteon

7. Conclusions

8. Analyst Contacts

8.1 Other Contacts

 


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