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RF & Wireless Components
Topics
  • Radio chipsets for handsets and mobile
  • Wireless broadband, 4G, LTE, WiMAX, WMAN
  • Cellular infrastructure
  • Wi-Fi, WLAN, Bluetooth, WPAN
  • Low-rate connectivity, mesh, ISM, GPS, RNSS
  • Short-range gigabit radio, 60 GHz, UWB
  • Front-end modules, power amplifiers, RF switches and filters
  • Competing fab processes: SiGe, GaAs, RF CMOS
  • New technologies, RF MEMS, tunable varicaps, metamaterials, fabrication processes and packaging
  • Radio system architectures, product integration roadmaps


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Strategy Analytics

PA Market in Flux: CMOS PAs and Envelope Tracking Emerge as Major Themes at MWC 2013

Author: Christopher Taylor

Publication Date: Mar 11 2013

Pages: 23

Report Type: Report, Word


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Summary

Qualcomm’s RF360 front-end subsystem for handsets elicited a flurry of power amplifier (PA) and envelope tracking (ET) announcements at MWC ’13 as competitive counterweight, with no fewer than 10 companies releasing new details about how they will support ET to enable better LTE devices. Adoption of ET in LTE handsets has suddenly moved about 18 months closer to reality, with first products likely to appear by late 2013 or early 2014 in production mobile devices. Perhaps paradoxically, new PAs and ET from Qualcomm’s GaAs-oriented competitors will dilute Qualcomm’s new presence in the RF front end, but widely available ET will also improve prospects for CMOS PAs, challenging the dominance of leading GaAs-based PA suppliers Skyworks, RFMD and others.

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Table of Contents

  • 1 Executive Summary
  • 2 Introduction
  • 3 Chipset Suppliers
    • 3.1 Qualcomm
      • 3.1.1 History in PA-FEMs
      • 3.1.2 Qualcomm's RF360
    • 3.2 Broadcom
    • 3.3 Fujitsu Semiconductor
  • 4 PA Suppliers
    • 4.1 Skyworks
    • 4.2 RF Micro Devices
    • 4.3 TriQuint
    • 4.4 ANADIGICS
    • 4.5 Peregrine Semiconductor
  • 5 Envelope Tracking Specialists
    • 5.1 Nujira
    • 5.2 Quantance
  • 6 Contact The Author of This Report
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