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GaAs & Compound Semiconductor Technologies
Topics
  • RF and microwave
  • Millimeter wave
  • Fiber optic analog
  • Optoelectronics
  • Bulk and epitaxial substrates, materials and equipment
  • GaAs MMIC, discrete and digital IC devices
  • LEDs, laser diodes, photovoltaics
  • Si, SiGe, GaN, SiC, InP
  • Wireless, broadband, consumer and military markets


Customer Analytics
  • Market Demand
  • Enabling Technologies
  • Segmentation
  • Market Dynamics and Trends
  • Market Opportunities


Business Solutions
  • Business Plans
  • Value Proposition
  • Segmentation Strategies
  • Product Roadmaps
  • Competitive Positioning


Report Types
  • Global Forecast
  • Regional Forecast
  • Viewpoints
  • Insights
  • Presentations
  • Data Models


Strategy Analytics

Compound Semiconductor Industry Review March 2012: Microelectronics

Author: Eric Higham

Publication Date: May 25 2012

Pages: 17

Report Type: Report, Word


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Summary

With the timing of financial reporting and product announcements in advance of February’s Mobile World Congress tradeshow, March was a quiet month. The announcements indicate that the industry is still devoting resources to process developments with several reports of SiC, SiGe and SoI advances. The product developments addressed emerging opportunities in the ISM bands and higher frequency ranges.

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Table of Contents

  • 1 Executive Summary
  • 2 Introduction
  • 3 MMICs
    • 3.1 Company Results
      • 3.1.1 M/A-COM Tech Prices IPO at $19 per Share
    • 3.2 Contracts
      • 3.2.1 RFMD Components Selected for LG Smartphones
    • 3.3 New Products
      • 3.3.1 Hittite Microwave Expands Portfolio
      • 3.3.2 M/A-COM Tech Introduces Optical Driver Solutions
      • 3.3.3 RFMD Introduces 915 MHz Transmit/Receive Module
      • 3.3.4 RFMD Announces 4.9 - 5.85 GHz Wi-Fi LNA
      • 3.3.5 Hittite Microwave Releases Backhaul Products
      • 3.3.6 TriQuint Develops 30W GaN Power Amplifier
      • 3.3.7 M/A-COM Tech Introduces High Power X-Band SPDT Switch
      • 3.3.8 TriQuint Releases DC - 6 GHz Gain Blocks
      • 3.3.9 RFMD Introduces Single-Chip 802.11 b/g/a/n Dual-Band FEM
    • 3.4 Other
      • 3.4.1 Skyworks products Support 802.11ac Platforms
      • 3.4.2 TriQuint Semiconductor Opens International Headquarters in Singapore
      • 3.4.3 RFMD Ships One Billionth PA to Chinese Handset Manufacturers
    • 3.5 Patents
  • 4 Silicon Devices
    • 4.1 New Products
      • 4.1.1 Mitsubishi Electric Develops EV Motor System with Built-in SiC Inverter
    • 4.2 Other
      • 4.2.1 SemiSouth Announces 2nd Major Capacity Expansion within 18 Months
      • 4.2.2 ST-Ericsson Selects Fully Depleted SoI Technology from Soitec
      • 4.2.3 IMEC Develops High Frequency SiGe HBT
      • 4.2.4 Infineon Orders Tokyo Electron Tool to Produce SiC Power Devices
      • 4.2.5 Peregrine Semiconductor Achieves ISO/TS 16949 Quality System Certification
      • 4.2.6 Javelin Semiconductor Names Vice President of Operations
      • 4.2.7 TowerJazz and UCSD Collaborate on Wafer-Scale Phased Array Transmitter
      • 4.2.8 DARPA Announces Foundry Technology Effort for Silicon Devices
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