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Topics
- Radio chipsets for handsets and mobile
- Wireless broadband, 4G, LTE, WiMAX, WMAN
- Cellular infrastructure
- Wi-Fi, WLAN, Bluetooth, WPAN
- Low-rate connectivity, mesh, ISM, GPS, RNSS
- Short-range gigabit radio, 60 GHz, UWB
- Front-end modules, power amplifiers, RF switches and filters
- Competing fab processes: SiGe, GaAs, RF CMOS
- New technologies, RF MEMS, tunable varicaps, metamaterials, fabrication processes and packaging
- Radio system architectures, product integration roadmaps
Customer Analytics
- Segmentation
- Market Demand Analysis
- Market Needs
Business Solutions
- Business Plans
- Value Proposition
- Segmentation Strategies
- Product Roadmaps
- Competitive Positioning
Report Types
- Forecasts & Market Reports
- Viewpoints
- Insights
- Presentations
- Data Models
This report compiles power amplifier, chipset, silicon IP and base station equipment trends and announcements from Mobile World Congress in 2012. Companies covered include Qualcomm, Intel, MediaTek, ST-Ericsson, Broadcom, Fujitsu, Lime Micro, Picochip, Altair, ARM, CEVA, Cognovo, IMEC, Tensilica, MIPS, Nujira, Ericsson, Alcatel-Lucent, RFMD, Skyworks, ANADIGICS, TriQuint and Black Sand.
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Table of Contents
- 1 Executive Summary
- 2 Semiconductor IP Firms
- 2.1 ARM Holdings
- 2.2 CEVA
- 2.3 Cognovo
- 2.4 IMEC
- 2.5 MIPS Technologies
- 2.6 Nujira
- 2.7 Tensilica
- 3 Chipset Suppliers
- 3.1 Altair Semi
- 3.2 Broadcom
- 3.3 CSR
- 3.4 Fujitsu
- 3.5 Intel IMC
- 3.6 Lime Microsystems
- 3.7 MediaTek
- 3.8 Mindspeed / Picochip
- 3.9 NVIDIA
- 3.10 Qualcomm
- 3.11 Sequans
- 3.12 ST-Ericsson
- 4 PA Vendors
- 4.1 ANADIGICS
- 4.2 Black Sand
- 4.3 RFMD
- 4.4 Skyworks Solutions
- 4.5 TriQuint
- 5 Infrastructure Equipment Vendors
- 5.1 Alcatel-Lucent
- 5.2 Ericsson
- 6 Other Companies
- 7 Contact the Author of This Report:
2 Jun 2013 to 7 Jun 2013
Seattle, US
© 2013 Strategy Analytics