RF Component Industry Review: July

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OFFICES

ANALYSTS

RF & Wireless Components

Topics

Radio chipsets for handsets and mobile
Wireless broadband, 4G, LTE, WiMAX, WMAN
Cellular infrastructure
Wi-Fi, WLAN, Bluetooth, WPAN
Low-rate connectivity, mesh, ISM, GPS, RNSS
Short-range gigabit radio, 60 GHz, UWB
Front-end modules, power amplifiers, RF switches and filters
Competing fab processes: SiGe, GaAs, RF CMOS
New technologies, RF MEMS, tunable varicaps, metamaterials, fabrication processes and packaging
Radio system architectures, product integration roadmaps

Customer Analytics

Segmentation
Market Demand Analysis
Market Needs

Business Solutions

Business Plans
Value Proposition
Segmentation Strategies
Product Roadmaps
Competitive Positioning

Report Types

Forecasts & Market Reports
Viewpoints
Insights
Presentations
Data Models

RF Component Industry Review: July - September 2011

Author: Christopher Taylor

Publication Date: Dec 06 2011

Pages: 71

Report Type: Report, Word

Navigation: RF & Wireless Components

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Summary

Global shipments of cellphones remained strong, growing sequentially from Q2 ‘11, contributing to a modest increase in profits for RF and wireless component suppliers overall, but amid signs of somewhat weaker sales growth to be reported in Q4 (for Q3). Merger & acquisition activity remained high, and stock volatility and dropping market prices around the globe delayed IPOs.

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1 Executive Summary
2 Summary and Analysis of Significant Developments

2.1 Financial Highlights
2.2 Product, Market, Technology Highlights
2.3 Mergers, Acquisitions, Divestitures
2.4 Initial Public Offerings of Stock
2.5 RF Startup Funding

3 Company Results

3.1 Financial

3.1.1 Nordic Q2 FY `11
3.1.2 Freescale Q2 FY `11
3.1.3 Intel Q2 FY `11
3.1.4 QUALCOMM Q3 FY `11
3.1.5 ST-Ericsson Q2 FY `11
3.1.6 Cypress Q2 FY `11
3.1.7 Skyworks Q3 FY `11
3.1.8 Hittite Q2 FY `11
3.1.9 Broadcom Q2 FY `11
3.1.10 Silicon Labs Q2 FY `11
3.1.11 TI Q2 FY `11
3.1.12 CEVA Q2 FY `11
3.1.13 DSP Group Q2 FY `11
3.1.14 RFMD Q1 FY 2012
3.1.15 Zoran Q2 FY `11
3.1.16 CSR Q2 FY `11
3.1.17 InterDigital Q2 FY `11
3.1.18 MediaTek Q2 FY `11
3.1.19 TriQuint Q2 FY `11
3.1.20 Fujitsu Q1 FY `11
3.1.21 Infineon Q3 `11
3.1.22 Maxim Q4 FY `11
3.1.23 Melexis Q2 FY `11
3.1.24 Microsemi Q3 FY `11
3.1.25 NetLogic Q2 FY `11
3.1.26 NXP Q2 FY `11
3.1.27 Sequans Q2 FY `11
3.1.28 Sumitomo Electric Q1 FY `11
3.1.29 TDK Q1 FY `12
3.1.30 TSMC Q2 FY `11
3.1.31 Murata Q1 FY 2012
3.1.32 Seiko-Epson Q1 FY 2012
3.1.33 Cavium Q2 FY `11
3.1.34 Renesas Q1 FY 2012
3.1.35 Zarlink Q1 FY 2012
3.1.36 Atmel Q2 FY `11
3.1.37 Entropic Q2 FY `11
3.1.38 UMC Q2 FY `11
3.1.39 ANADIGICS Q2 FY `11
3.1.40 Ralink Q2 FY `11
3.1.41 Spreadtrum Q2 FY `11
3.1.42 TowerJazz Q2 FY `11
3.1.43 NDK Q1 FY 2012
3.1.44 Taiyo-Yuden Q1 `11
3.1.45 RDA Micro Q2 FY `11
3.1.46 Cree Q4 and FY `11
3.1.47 MStar Semi Q2 FY `11
3.1.48 Nvidia Q2 `12
3.1.49 Sony Q1 FY 2012
3.1.50 Analog Devices Q3 FY `11
3.1.51 Marvell Q2 FY `11
3.1.52 Avago Tech Q3 FY `11
3.1.53 u-blox H1 FY `11
3.1.54 Skorpios Raises $19 Million
3.1.55 Zenverge Raises $20.5 Million
3.1.56 Quantance Raises $11 million
3.1.57 RF Monolithics Q4 FY `11

3.2 Contracts

3.2.1 Neul Launches White Space Radio
3.2.2 Marvell TD-SCDMA Baseband in Smartphones from China Mobile
3.2.3 Enspert Selects U-Blox GPS for Tablet / E-Readers
3.2.4 MagnaChip Ramps Production of Peregrine Semi RF Switches
3.2.5 SAXA Adopts GainSpan for ULP Wi-Fi
3.2.6 NETGEAR Chooses Quantenna for HD Video Streaming
3.2.7 Murata Selects GainSpan ULP Wi-Fi for Modules
3.2.8 Cognovo Low-Power Baseband Nears Production
3.2.9 TI to Use MimoON PHY for Small Cells
3.2.10 Sequans in HTC WiMAX Devices
3.2.11 Z-Wave in Best Buy Insignia Brand
3.2.12 Siano Automotive Mobile TV Win
3.2.13 Intel, Entropic Comms to ICs for Home Gateways to SMC
3.2.14 Samsung Selects u-blox GPS
3.2.15 Marvell in Huawei TD-SCDMA Smartphone
3.2.16 ANADIGICS' LTE PA in LG Android Smartphone
3.2.17 AirTies Using Quantenna for Wireless HD Video
3.2.18 Acer to Use Qualcomm Atheros Bluetooth in Laptops
3.2.19 Microchip PA for Wi-Fi
3.2.20 NetComm Chooses Sequans for TD-LTE
3.2.21 Skyworks FEMs for ZTE
3.2.22 Qualcomm in AT&T LTE Tablet
3.2.23 Qualcomm Ships Basebands to Nokia
3.2.24 Nufront Selects CEVA DSP Cores
3.2.25 Meizu Selects u-blox GPS
3.2.26 Qualcomm Chipsets in Multi-mode TD-LTE Devices for India
3.2.27 Agama Using Celeno Wi-Fi In-Home Monitoring System
3.2.28 Samsung Using Spreadtrum for TD-SCDMA Smartphone
3.2.29 Mirics in AMD Tuner Card
3.2.30 Panda Electronics Using Picochip
3.2.31 Picochip & ASTRI Commercial-Grade LTE for Small Cells
3.2.32 ANADIGICS PAs in CASIO Ruggedized Smartphone
3.2.33 Celeno Collaborating with Sigma Designs for STB Ref Designs
3.2.34 Silicon Image in Epson WirelessHD Projector
3.2.35 RFaxis & Freescale Reference Designs for ZigBee
3.2.36 u-blox in Personal Tracker
3.2.37 Fühlen Selects Cypress WirelessUSB
3.2.38 Samsung Chooses Quantenna Wi-Fi Chips
3.2.39 Renesas ZigBee in AND TR Design Kits for Smart Energy
3.2.40 ST-Ericsson Processors in HTC Smartphone
3.2.41 Lantiq Chooses Altair Semi for LTE for Home Gateways
3.2.42 DECT from DSP Group in Gigaset Phones
3.2.43 Harris Selects Altair Semi
3.2.44 Redpine Signals Ultra-Low-Power 802.11n Wi-Fi
3.2.45 TANITA Chooses GainSpan Wi-Fi
3.2.46 Qualcomm Atheros & Mindspeed Video-Over-Wi-Fi
3.2.47 Qualcomm Atheros & EDIMAX Video-over-Wireless Bridge

3.3 Joint Ventures

3.3.1 MediaTek Collaboration with WiTricity for Wireless Charging
3.3.2 Samsung & DoCoMo Discuss Joining Forces
3.3.3 Qualcomm & Microsoft Collaborate on Mobile Processors for Windows 8
3.3.4 Imagination Tech Deal with Orca Systems

3.4 Employment

3.4.1 Qualcomm Appoints CTO
3.4.2 Trident Cuts Staff
3.4.3 Nokia Appoints CTO

3.5 New Products

3.5.1 TriQuint Linear Amp for 10 - 12 GHz
3.5.2 TI Sub-1 GHz RF Value Line Family
3.5.3 TI Module Platform for Wi-Fi and Bluetooth
3.5.4 Taoglas Mobile Device Antenna
3.5.5 Peregrine Digitally Tuned Capacitors
3.5.6 RFMD Launches Foundry p-HEMT Process
3.5.7 MediaTek Wi-Fi Combo Chip
3.5.8 Fujitsu FRAM-based RFID Chips
3.5.9 M/A-COM Tech RFICs for MoCA
3.5.10 National Semi Direct Sampling ADCs
3.5.11 TriQuint SAW Filters for LTE Base Stations
3.5.12 GreenPeak ZigBee RF4CE
3.5.13 Qualcomm Announces 28 nm Basebands-Apps Processors
3.5.14 Orca Bluetooth Core
3.5.15 Infineon's Small GPS Receiver
3.5.16 TI Transceiver for NFC
3.5.17 Hittite GaN 10 Watt PA
3.5.18 Tensilica Integer DSP Core for Cellular
3.5.19 SkyTraq GPS Receiver
3.5.20 NDK TCXO for WLAN
3.5.21 TI Control Chip for Wireless Charging
3.5.22 Hittite PA for VSAT and Microwave Radio
3.5.23 Accent Spa Smart Meter Radio ICs
3.5.24 Broadcom Tuner-Demodulator for DBS-TV
3.5.25 Marvell PXA1801 LTE Baseband
3.5.26 Celeno Video-Grade Wi-Fi
3.5.27 Freescale HP RF Power Transistor for Broadcast TV
3.5.28 Analog Devices VGAs for Broadband
3.5.29 Qualcomm Femtocell Ref Designs
3.5.30 DECT Chips from Dialog Semi
3.5.31 Intel and Google to Develop x86 Versions of Android
3.5.32 Cypress Very Low-Power 2.4 GHz Transceiver
3.5.33 NXP DBS-TV Downconverters
3.5.34 Tahoe RF GPS
3.5.35 Broadcom NFC
3.5.36 Cavium STB SoC
3.5.37 Avago Tech VGA for Cellular Base Stations

3.6 Mergers, Acquisitions, Other

3.6.1 Microsemi Acquires ASIC Advantage
3.6.2 Dish Network to Acquire Torstar
3.6.3 NextWave Warns of Likely Bankruptcy
3.6.4 Spreadtrum to Acquire Telegent Systems
3.6.5 Microsemi Acquires Brijot Imaging
3.6.6 Mindspeed Buys Assets of IPG Communications
3.6.7 IEEE Published White Space Standard
3.6.8 Google Could Acquire InterDigital for IP
3.6.9 US Government Considers White Space Auctions
3.6.10 New ZigBee Specification
3.6.11 Parrot to Acquire DiBcom
3.6.12 Murata to Acquire Renesas Electronics PA Business
3.6.13 M/A-COM Tech files for IPO
3.6.14 Intel Pushes Ultrabooks
3.6.15 Google to Acquire Motorola Mobility
3.6.16 CSR & Zoran Combine
3.6.17 Qualcomm to Acquire Video Processing Assets from IDT
3.6.18 Broadcom to Acquire NetLogic Microsystems, Inc
3.6.19 GCT to Raise $100 million in IPO
3.6.20 IBM Reports Graphene Frequency Doubler
3.6.21 Skyworks' Acquisition of Advanced Analogic Delayed
3.6.22 u blox Acquires Fusion Wireless
3.6.23 Broadcom Exits DTV Chips
3.6.24 Microsemi to Acquire Zarlink Semi
3.6.25 TI Completes Acquisition of National Semi
3.6.26 Sprint to Dump WiMAX for LTE

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RF Component Industry Review: July - September 2011

Summary

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